Optoelectronic Module Contact Layout for Low-Profile Cooling
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Solution Overview
Problem
The existing optoelectronic components suffer from high connector height, occupying excessive space and limiting the installation of other components or effective heat dissipation mechanisms.
Innovation Solution
The optoelectronic component design includes a golden finger on one surface of the module circuit board and a conductive elastomer on the host circuit board, reducing the height occupied by the conductive elastomer, allowing for an air duct through the optical module ends and enabling heat sink installation on the opposite surface for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connector with conductive elastomers is installed on the host circuit board, then electrical connection is implemented, but the connector occupies high space and limits space for other components
Solution Approach 1:
The conductive elastomer is extracted from a traditional connector housing and directly mounted onto the host circuit board. This removes the bulky connector structure while retaining the essential electrical connection function through the elastomer itself, significantly reducing the space occupied by the connection mechanism.
Solution Approach 2:
The conductive elastomer serves as a thin, flexible conductive element that provides electrical connection without requiring a rigid connector housing. Its elastic nature allows it to deform during insertion and maintain reliable contact while occupying minimal space on the circuit board.
2Reliability
If a high connector is used for electrical connection, then connection reliability is improved, but heat dissipation at the end is impaired due to blocked air flow
Solution Approach 1:
By extracting the conductive elastomer from a bulky connector housing, the air flow path along the end of the optical module is restored. This allows natural convection to occur freely, improving heat dissipation while the elastomer maintains reliable electrical connection through its elastic contact properties.
3Adaptability or versatility
If golden fingers are disposed on two opposite surfaces of the module circuit board, then electrical connection options are increased, but the conductive elastomer would be located on two sides increasing height space
Solution Approach 1:
The connection design transitions from a two-sided arrangement (golden fingers on both opposite surfaces) to a one-sided arrangement (golden fingers on only one surface). This dimensional simplification reduces the height space occupied by the conductive elastomer while maintaining adequate connection options through proper positioning and numbering of the golden fingers on the single active surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces space usage by the conductive elastomer, facilitating the installation of additional components and improving heat dissipation through convection and thermal conductivity, enhancing overall performance.
Implementation Method 1
the golden finger is in contact with the conductive elastomer, to implement electrical connection between the optical module and the host circuit board
Implementation Method 2
an air duct that passes through a first end and an opposite second end of the optical module may be formed. The air duct that passes through the first end and the second end of the optical module is formed, and convection is formed. This helps enhance a heat dissipation effect of the optical module.
Implementation Method 3
along with a heat sink and thermally conductive layer for improved heat transfer
Data Source
AI summary
An optoelectronic component includes an optical module and a host circuit board. The optical module includes a module circuit board and a gold finger that is located on a first surface of the module circuit board. The host circuit board includes a conductive elastomer corresponding to the gold finger and that is located on a first surface of the host circuit board. The module circuit board is located on the host circuit board, the first surface of the module circuit board and the first surface of the host circuit board face each other, and the gold finger is in contact with the conductive elastomer.