Optoelectronic Semiconductor Contact Layout for Uniform Light Emission
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Solution Overview
Problem
Existing optoelectronic semiconductor elements, such as LEDs, face challenges in improving light emission efficiency and mechanical stability due to the arrangement of contact elements and passivation layers, which can affect the uniformity of current injection and outcoupling of electromagnetic radiation.
Innovation Solution
The optoelectronic semiconductor element features a layer stack with a first semiconductor layer patterned to expose part of a second semiconductor layer, where identical intermediate layers connect the contact elements to the semiconductor layers, ensuring uniform current injection and enhanced mechanical stability through a specific arrangement of contact elements and passivation layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If contact elements are arranged at different heights on the first semiconductor layer, then the manufacturing process is simpler, but tilting effects occur that distort the radiation pattern
Solution Approach 1:
The patent applies the equipotentiality principle by arranging both contact elements at the same height above the first semiconductor layer. This creates a symmetric, level configuration that prevents tilting effects and ensures uniform radiation patterns in all directions, while still allowing for a relatively simple manufacturing process through standard lithography and deposition techniques.
2Ease of manufacture
If the first semiconductor layer is left unpatterned, then the manufacturing process is simpler, but current injection uniformity is poor
Solution Approach 1:
The patent applies segmentation by patterning the first semiconductor layer into distinct regions with different thicknesses or compositions. This creates zones that facilitate uniform current distribution across the active area, ensuring consistent current injection while maintaining a manufacturable structure through standard photolithography patterning processes.
3Reliability
If different intermediate layers are used between contact elements and semiconductor layer, then contact optimization is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies homogeneity by using identical intermediate layers between both contact elements and the first semiconductor layer. This symmetric configuration ensures consistent electrical properties and contact performance while significantly simplifying the manufacturing process, as the same layer deposition and patterning steps can be reused for both contacts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the light emission efficiency and mechanical stability of the semiconductor element by ensuring uniform current injection and efficient outcoupling of electromagnetic radiation, while preventing tilting effects that could distort the radiation pattern.
Implementation Method 1
If electrons and holes recombine with one another in the area of the pn junction, for example, because a corresponding voltage is applied, electromagnetic radiation is generated.
Data Source
AI summary
An optoelectronic semiconductor element may include an optoelectronic semiconductor chip. The optoelectronic semiconductor chip may include a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first contact element connected to the first semiconductor layer in an electrically conductive manner, and a second contact element connected to the second semiconductor layer in an electrically conductive manner. The first semiconductor layer and the second semiconductor layer are arranged one above the other to form a layer stack. The first semiconductor layer to where the second semiconductor layer is exposed. The first contact element is arranged over the first semiconductor layer, and the second contact element is arranged over the first semiconductor layer.