Optoelectronic Semiconductor Contact Structure Molding via Template Extraction
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Solution Overview
Problem
Current methods for producing optoelectronic semiconductor components are inefficient and costly, particularly due to the need for photolithographic patterning of electrical contact structures.
Innovation Solution
A method involving an intermediate carrier with fixing points and optoelectronic semiconductor chips, where connecting means are applied locally to fix the chips, and a potting layer surrounds them, allowing for detachment and the formation of recesses that serve as molds for electrical contact structures, eliminating the need for photolithographic patterning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithographic patterning is used to form electrical contact structures, then manufacturing precision is improved, but device complexity and production cost increase
Solution Approach 1:
The patent extracts the photolithographic patterning step from the manufacturing process by using a template that directly defines the contact structure geometry. The template physically masks certain areas during material deposition, eliminating the need for separate photolithography, photoresist application, and etching steps while maintaining precise contact structure formation.
Solution Approach 2:
The template is prepared in advance with the exact geometric pattern needed for the contact structures. This preliminary action allows the contact structures to be formed directly during material deposition without requiring subsequent patterning steps, thereby simplifying the overall manufacturing process while preserving precision.
2Manufacturing precision
If photolithographic patterning is used to form electrical contact structures, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
The patent removes the expensive photolithography process by using a template-based approach where the contact structure pattern is defined by the template geometry itself. This eliminates costs associated with photoresist materials, photolithography equipment operation, and multiple processing steps while maintaining the necessary manufacturing precision through the template's physical structure.
Solution Approach 2:
The template serves as a disposable or reusable masking element that defines the contact structure pattern. Rather than investing in expensive photolithography infrastructure, the process uses a relatively simple template that can be fabricated at lower cost and used to directly pattern the contact structures during material deposition.
3Ease of manufacture
If connecting means are applied locally at contact points, then ease of manufacture is improved, but manufacturing precision requirements increase
Solution Approach 1:
The template acts as an intermediary that simplifies the application of connecting means. Instead of requiring precise direct application of material to each contact point, the template serves as a mediator that guides material deposition to the correct locations through its geometric structure, thereby reducing the precision requirements for the application process itself while ensuring accurate contact structure formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables cost-effective production of optoelectronic semiconductor components by avoiding photolithographic patterning, ensuring secure chip attachment and efficient contact structure formation, thereby reducing production costs and enhancing manufacturing efficiency.
Implementation Method 1
The connecting means are applied either at the contact points on the semiconductor chips or alternatively at the fixing points on the intermediate carrier... a material of the connecting means adheres only to the fixing points
Implementation Method 2
one or more potting layers is/are generated on the carrier top. As a result of the at least one potting layer, the semiconductor chips and the contact points, as well as preferably the connecting means, are completely surrounded by the potting layer
Implementation Method 3
the connecting means are preferably partially or completely removed from the semiconductor chips. This makes it possible for the contact points to be exposed and to be freely accessible
Implementation Method 4
The recesses each have a shape corresponding to a negative mold of the connecting means previously applied on the contact points
Data Source
AI summary
The invention relates in at least one embodiment to the production of optoelectronic semiconductor components and comprises the steps: A) providing an intermediate carrier (2) having a plurality of fixing points (23), B) providing optoelectronic semiconductor chips (3) each having a chip upper side (30) and a mounting side (32) located opposite thereto, wherein electric contact points (34) of the semiconductor chips (3) are each located on the mounting sides (32), C) attaching connecting means (4), D) fixing the contact points (34) to the fixing points (23) by means of the connecting means (4), E) producing a potting layer (5), such that the semiconductor chips (3) and the contact points (34) and the connecting means (4) are directly surrounded all round by the potting layer (5), F) detaching the semiconductor chips (3), such that the connecting means (4) are removed from the semiconductor chips (3) and recesses (44) are each provided at the contact points (34) as a negative form in relation to the connecting regions (4), and G) producing electric contact structures (6).