Position-Tolerance-Insensitive Optoelectronic Contacting Module
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Solution Overview
Problem
Existing wafer level test systems for optoelectronic chips are inefficient due to sequential and time-consuming optical coupling, lack of parallel measurement capabilities, and the need for complex and costly modifications to conventional wafer probers, which are not compatible with established electrical contacting methods.
Innovation Solution
A position-tolerance-insensitive optoelectronic contacting module that uses a combination of an electronic module with a printed circuit board for electrical signals and an optical module with integrated waveguides and beam shaping elements, allowing for simultaneous electrical and optical signal transmission with reduced adjustment sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If glass fiber-based optical coupling is used with submicron accuracy adjustment, then optical coupling efficiency is improved, but device complexity and adjustment time increase significantly
Solution Approach 1:
The patent extracts the complex adjustment mechanisms (actuators, hexapods, piezo elements) from the contacting module design. Instead of integrating these complex components, the invention uses a simple passive optical element (lens) that can be positioned using conventional, low-precision mechanisms, thereby eliminating the need for submicron adjustment capabilities while maintaining optical coupling efficiency
Solution Approach 2:
The patent employs inexpensive, simple optical elements (lenses) that can be easily replaced rather than using complex, expensive adjustable optical systems. The lens is positioned at a fixed distance from the chip surface, eliminating the need for expensive active adjustment components while achieving sufficient optical coupling
2Reliability
If sequential optical coupling is performed for each chip, then optical signal transmission is achieved, but productivity decreases due to time-consuming adjustment sequences
Solution Approach 1:
The patent performs preliminary positioning of the lens at a fixed, predetermined distance from the chip surface before actual optical coupling is needed. This preliminary setup eliminates the need for time-consuming active adjustment sequences before each measurement, allowing rapid sequential testing of multiple chips while maintaining reliable optical signal transmission
Solution Approach 2:
The patent enables continuous optical coupling across multiple chips by maintaining the lens at a fixed optimal distance from the chip surface. This continuous positioning allows sequential chip testing to proceed without interruption for adjustment sequences, significantly improving throughput while maintaining signal transmission quality
3Adaptability or versatility
If conventional wafer probers are modified with high-precision actuators for optical coupling, then optical contacting capability is improved, but device complexity and cost increase
Solution Approach 1:
The patent designs the optical module to work with conventional wafer probers using their existing positioning and adjustment capabilities. The lens is positioned at a fixed distance that can be achieved with standard mechanical adjustments, allowing the same contacting module to test both electrical and optical interfaces without requiring separate high-precision actuation systems
Solution Approach 2:
The patent introduces a simple lens as an intermediary optical element between the light source and the chip's optical interface. This lens mediates the optical coupling process, enabling conventional wafer probers to perform optical testing without direct modification, as the lens can be positioned using existing mechanical adjustment mechanisms
4Measurement precision
If active adjustment sequences are performed before each optical coupling, then coupling efficiency is maximized, but measurement time increases
Solution Approach 1:
The patent performs the critical positioning action in advance by setting the lens at a fixed optimal distance from the chip surface during module assembly or initial setup. This preliminary positioning eliminates the need for time-consuming active adjustment sequences before each measurement, while maintaining high coupling efficiency through the pre-optimized geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and repeatable transmission of optical signals with reduced sensitivity to positional tolerances, improving throughput and measurement reliability without requiring complex modifications to existing test apparatuses.
Implementation Method 1
the optical inputs and outputs on the contacting module with the optical inputs and outputs of the at least one optoelectronic chip delimit, in respective pairs, a free beam optical region for transmitting the optical signals
Implementation Method 2
the optical signals transmitted from the contacting module to the at least one optoelectronic chip irradiate the optical inputs of the at least one optoelectronic chip in each of the adjustment positions
Data Source
AI summary
The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (AoC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (EoK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (So) to be coupled in.