Optoelectronic Component Covering Layer with Predetermined Breaking Surface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Optoelectronic components such as OLEDs and organic solar cells face damage to their thin-film encapsulation due to mechanical loading, leading to delamination and impairment of the component's functionality, as the additional cover substrate layer can delaminate and expose the encapsulation to moisture and oxygen.
Innovation Solution
Incorporating a covering layer with a predetermined breaking surface within its interior, which allows for mechanical loading to cause separation away from the encapsulation layer, maintaining the integrity of the encapsulation and preventing damage, while the covering layer provides continued mechanical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a cover substrate layer is added to provide mechanical protection to the thin-film encapsulation, then the mechanical strength of the optoelectronic component is improved, but the risk of delamination and damage to the encapsulation layer increases under mechanical loading
Solution Approach 1:
The covering layer is segmented into a first covering layer portion and a second covering layer portion separated by a breaking surface. This segmentation allows the covering layer to delaminate in a controlled manner along the breaking surface when subjected to mechanical loading, preventing uncontrolled delamination that would damage the encapsulation layer. The breaking surface acts as a predetermined failure plane that protects the encapsulation by directing stress away from it.
2Reliability
If the covering layer is made strongly bonded to the encapsulation layer to prevent delamination, then the reliability of the encapsulation is improved, but the mechanical stress concentrates at the interface causing potential damage
Solution Approach 1:
The breaking surface acts as an intermediary element between the covering layer and the encapsulation layer. It provides a controlled separation plane that mediates the stress transfer, allowing the covering layer to detach in a controlled manner without transmitting damaging stresses to the encapsulation layer. This intermediary breaking surface prevents direct stress concentration at the encapsulation interface.
Data Source
AI summary
An optoelectronic component includes a substrate, a first electrode on the substrate, a radiation-emitting or radiation-absorbing layer sequence on the first electrode, a second electrode on the layer sequence, an encapsulation layer on the second electrode, and a covering layer on the encapsulation layer. The covering layer has a first main surface and second main surface. At least one intended rupture surface is provided between the first and the second main surface of the covering layer.