Optoelectronic Package Frame Recess for Compact Chip Protection
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Solution Overview
Problem
Existing optoelectronic components face challenges in achieving compact external dimensions and robust protection for semiconductor chips against external influences while maintaining a stable connection between the frame and carrier.
Innovation Solution
An optoelectronic component design featuring a frame with a recess on its lower side, adhered to the carrier, and filled with encapsulation material, which provides a robust connection and compact dimensions, with optional anchoring structures and adhesive placement for enhanced stability and mounting of optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the frame is fastened to the carrier using adhesive over a large contact area, then the connection stability is improved, but the external dimensions of the optoelectronic component increase
Solution Approach 1:
The recess in the frame's lower side creates a vertical dimension for encapsulation material placement, allowing the adhesive contact area to be minimized while maintaining connection stability through the encapsulation material's anchoring effect
Solution Approach 2:
The encapsulation material serves as a sacrificial element that provides mechanical anchoring through the recess, replacing the need for large-area adhesive bonds while enabling compact dimensions
2Volume of moving object
If the frame is made compact with minimal adhesive area, then the external dimensions are reduced, but the connection stability between frame and carrier deteriorates
Solution Approach 1:
The recess creates a localized region in the frame's lower side that provides enhanced anchoring capability, concentrating the connection stability function in a specific area rather than requiring distributed adhesive coverage
Solution Approach 2:
The encapsulation material acts as an intermediary that fills the recess and creates a mechanical interlock between the frame and carrier, providing connection stability without requiring large adhesive areas
3Stability of the object's composition
If adhesive is placed in the recess region, then the frame fixation is improved, but the contact area for encapsulation material is reduced
Solution Approach 1:
The recess is pre-formed in the frame's lower side to prepare for encapsulation material placement, ensuring that the encapsulation material has adequate contact area and anchoring capability before adhesive application
Solution Approach 2:
The recess creates a localized anchoring region that concentrates the frame fixation function, allowing adhesive to be placed only in corner regions while maintaining strong fixation through the encapsulation material's presence in the recess
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact form factor with a stable and robust connection between the frame and carrier, protecting the semiconductor chip from external damage and allowing for defined optical element positioning without additional mounting elements.
Implementation Method 1
The lower side of the frame is fastened on the upper side of the carrier by means of an adhesive
Implementation Method 2
an encapsulation material is arranged, is in contact with the frame and at least partially fills the recess of the frame
Data Source
AI summary
The invention relates to an optoelectronic component comprising a carrier, an optoelectronic semiconductor chip arranged on the upper side of the carrier, and a frame which is arranged on the upper side of the carrier and which frames the optoelectronic semiconductor chip. An underside of the frame, which faces the upper side of the carrier, has at least one recess. In a spatial area framed by the frame on the upper side of the carrier, there is arranged a potting material which is in contact with the frame and at least partly fills the recess in the frame.