Optoelectronic Component Production via Frame Assembly Singulation

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Solution Overview

Problem

The production of optoelectronic components that combine optical elements with semiconductor chips is complex and requires a sophisticated process.

Innovation Solution

A method involving a connection carrier assembly, frame assembly, and optics assembly where semiconductor chips are arranged on the connection carrier, optical elements are positioned relative to the frame, and the assemblies are singulated to form optoelectronic components with each component comprising a connection carrier, frame, and optical element, allowing for simple and reliable production with self-adjusting optical elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If optical elements and semiconductor chips are combined using conventional methods, then optoelectronic components can be produced, but the production process becomes complicated and complex

Engineering Contradiction:

Improveproduction reliabilityVSAvoidproduction process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple production steps and components into integrated assemblies. The frame assembly with multiple openings and the optics assembly with multiple optical elements are positioned and attached simultaneously to a connection carrier assembly containing multiple semiconductor chips. This merging of operations and components simplifies the overall production process while maintaining reliability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The production system is divided into distinct modular assemblies: the connection carrier assembly holding semiconductor chips, the frame assembly with openings, and the optics assembly with optical elements. These segmented assemblies are independently prepared and then combined, making the complex production process more manageable and systematic.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If multiple optical elements are positioned individually for each semiconductor chip, then precise alignment can be achieved, but the production time and complexity increase

Engineering Contradiction:

Improveoptical alignment precisionVSAvoidproduction efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

Multiple optical elements are arranged in a common optics assembly that is positioned and attached as a single unit to the connection carrier assembly. This allows simultaneous positioning of multiple optical elements relative to multiple semiconductor chips, achieving precise alignment for all components in one operation rather than individually, thereby significantly improving production efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The frame assembly with its structured openings and the optics assembly with arranged optical elements are designed to self-align with the connection carrier assembly during the positioning process. This self-aligning mechanism ensures precise optical alignment without requiring complex external alignment procedures for each component, maintaining manufacturing precision while speeding up production.

Inventive Principle:

Principle #25Self-service

3Object-affected harmful factors

If optical elements cover the semiconductor chips completely, then optical protection is provided, but mechanical stress may be applied to the chips

Engineering Contradiction:

Improveoptical protectionVSAvoidchip mechanical strength

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The frame assembly is designed with openings that allow the optical elements to cover and protect the semiconductor chips optically, while the frame structure itself is positioned between the optical elements and the chips to mechanically isolate them. This extraction of the protective function from direct mechanical contact prevents stress transmission to the chips while maintaining optical coverage.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The frame assembly acts as an intermediary structure between the optical elements and the semiconductor chips. It provides the mounting structure for the optical elements and defines the openings through which optical protection is achieved, while preventing direct mechanical contact between the optical elements and the chips, thus protecting the chips from mechanical stress.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS9466769B2Method for producing a plurality of opto-electronic components and opto-electronic component

Publication Date: 2016.10.11 OSRAM OLED

AI summary

A method is provided for producing a plurality of optoelectronic components. A number of semiconductor chips are arranged on a connection carrier assembly. A frame assembly with a number of openings is arranged in such a way, relative to the connection carrier assembly, that the semiconductor chips are each arranged in one of the openings. A number of optical elements are positioned in such a way, relative to the frame assembly, that the optical elements cover the openings. The connection carrier assembly with the frame assembly and the optical elements is singulated into the number of optoelectronic components, such that each optoelectronic component includes one connection carrier with at least one optoelectronic semiconductor chip, one frame with at least one opening and at least one optical element.