Optoelectronic Package Heat Dissipation Interference Fit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optoelectronic semiconductor packages face inefficiencies in heat dissipation due to high thermal contact resistance and long heat flow paths, along with increased fabrication costs and time required for soldering heat pipes to copper blocks.
Innovation Solution
The solution involves an optoelectronic semiconductor package design with a base having openings for heat-dissipation elements, where these elements are pressed and deformed to create an interference fit, eliminating the need for soldering and reducing the number of interfaces, thus shortening the heat flow path and lowering thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat pipes are soldered to copper block, then heat-dissipation function is achieved, but fabrication time and cost increase
Solution Approach 1:
The invention extracts and eliminates the copper block from the heat sink structure, directly attaching heat pipes to the base. This removes the unnecessary intermediate component that caused both time loss (soldering process) and increased complexity, while maintaining the heat-dissipation function through direct heat pipe attachment to the laser diode chip base.
Solution Approach 2:
The invention merges the base and heat sink functions into a unified structure where heat pipes are directly attached to the base. This consolidation eliminates the separate copper block component and its associated soldering process, reducing fabrication time and cost while achieving the same heat-dissipation objective through integrated design.
2Ease of operation
If multiple interfaces are used in heat flow path, then component mounting is facilitated, but thermal contact resistance increases
Solution Approach 1:
The invention merges the heat flow path into fewer interfaces by directly attaching heat pipes to the base, eliminating the copper block intermediate layer. This reduces the number of thermal interfaces from three (chip-base-copper block-heat pipe) to two (chip-base-heat pipe), significantly reducing thermal contact resistance while maintaining ease of component mounting.
3Device complexity
If distance between heat pipe and laser diode chip is increased, then packaging is simplified, but heat-dissipation efficiency decreases
Solution Approach 1:
The invention applies local quality optimization by positioning heat pipes directly at the locations where heat is generated on the base, close to the laser diode chip. This localized heat-dissipation approach ensures efficient heat removal from critical areas without requiring complex packaging structures, maintaining both simplicity and effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat-dissipation efficiency, reduces operational temperatures, and lowers fabrication costs by simplifying the attachment process and minimizing thermal resistance, as demonstrated by reduced temperature and thermal resistance measurements compared to conventional designs.
Implementation Method 1
the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base
Implementation Method 2
the heat-dissipation element placed in the corresponding opening is pressed by a pressing plate to generate deformation and thus creates an interference fit between the opening of the base and the heat-dissipation element
Implementation Method 3
The heat sink 104, serving to dissipate the heat generated by the laser diode chip 106 during its operation
Data Source
AI summary
An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.