Optoelectronic Device Housing Footprint Reduction
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Solution Overview
Problem
Current optoelectronic devices face limitations in reducing the footprint of their housings, which restricts the size of the optoelectronic chip that can be used, as existing methods for optical fiber coupling require minimum housing widths and lengths, hindering the integration of longer or wider chips within existing footprints.
Innovation Solution
The optoelectronic device incorporates an optical coupling element bonded to the chip, with at least a portion protruding through a housing aperture, allowing for butt-coupling with an optical fiber and using an external feed-through and strain relief collar for alignment and protection, enabling a smaller housing footprint and accommodating larger chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the housing footprint is reduced to minimize device size, then the housing can be more compact and suitable for size-sensitive applications, but the chip size that can be accommodated is limited
Solution Approach 1:
The patent extends the optical coupling element beyond the housing boundary in the lateral dimension, allowing the chip to be larger than the housing footprint would normally permit. The coupling element protrudes through the housing wall, effectively using external space to accommodate larger chip dimensions while maintaining a compact housing footprint.
Solution Approach 2:
The optical coupling element is extracted from the internal housing space and positioned partially outside the housing. This extraction allows the coupling element to serve as an external interface structure that enables larger chip integration without increasing the housing footprint, as the coupling functionality is moved to the housing boundary.
2Ease of operation
If alignment apparatus access is provided to position components within the housing, then component alignment is enabled, but the housing width must be sufficient to accommodate the alignment equipment
Solution Approach 1:
The optical coupling element is pre-positioned and bonded to the chip before final housing assembly. This preliminary action allows alignment to be performed on the protruding coupling element that extends beyond the housing, enabling alignment apparatus to access and position components without requiring wide housing dimensions.
Solution Approach 2:
The optical coupling element serves as an intermediary structure that extends outside the housing, providing an accessible interface for alignment apparatus. This mediator allows alignment operations to be performed on external structures rather than requiring direct access to internal components within the constrained housing space.
3Area of stationary object
If bulk optical components are reduced in size to minimize housing footprint, then the housing can be more compact, but only limited reduction in housing length is achieved
Solution Approach 1:
The patent shifts the optical coupling interface from an internal arrangement to an external protruding structure. By positioning the optical coupling element outside the housing boundary, the housing length can be reduced while still accommodating the necessary optical coupling functionality through the extended coupling element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a smaller housing footprint, facilitating the use of longer or wider optoelectronic chips and simplifies assembly by providing convenient access for alignment and handling of the optical fiber, while maintaining environmental protection and mechanical robustness.
Implementation Method 1
The optical coupling element is bonded to an end of an optical fibre such that both the optical fibre and optical coupling element are butt-coupled to the chip, and such that the optical fibre is optically coupled with an optical waveguide of the chip
Data Source
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Figure 3A~3B
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AI summary
There is described an optoelectronic device having a housing and a chip housed by the housing. At least a portion of the chip protrudes through an aperture in a wall of the housing. There is further provided an optoelectronic module comprising such an optoelectronic device and electronic control circuitry adapted to control the operation of the optoelectronic device.