Optoelectronic Component Housing with Setback Soldering Contacts
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Solution Overview
Problem
Optoelectronic components, such as light emitting diode components, face limitations in miniaturization due to the required minimum size of their housings, which restricts the compactness of electronic devices with printed circuit boards.
Innovation Solution
The design of an optoelectronic component with a housing featuring a chip receptacle space, protruding contact webs, and strategically positioned soldering contact surfaces allows for a space-saving arrangement on a printed circuit board, utilizing electrically insulating plastic material and metallizations for efficient electrical contacting and reduced structural space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the housing size is reduced to enable miniaturization, then the electronic device can be more compact, but the optoelectronic component cannot achieve desired optical properties
Solution Approach 1:
The patent transitions from traditional planar mounting to three-dimensional integration by arranging soldering contact surfaces on multiple faces of the housing (front, rear, left, and right sides). This spatial redistribution allows the optoelectronic component to be mounted in a cutout of the printed circuit board, effectively utilizing vertical and lateral dimensions to reduce the horizontal footprint while maintaining adequate housing volume for optical functionality.
2Length of stationary object
If the housing size is reduced, then space above and below the printed circuit board is reduced, but mounting reliability and electrical connection stability deteriorate
Solution Approach 1:
The patent segments the soldering contact surfaces across multiple distinct locations on the housing - front side, rear side, left side, and right side. This segmentation distributes the mechanical and electrical connection points throughout the housing structure, enhancing mounting reliability through multiple attachment points while maintaining a compact overall profile that reduces the required structural space.
Data Source
AI summary
An electronic device includes a printed circuit board having a cutout, wherein an optoelectronic component including a housing having an outer surface, the housing has a chip receptacle space at a top side, an optoelectronic semiconductor chip is arranged in the chip receptacle space, the housing has a first soldering contact surface and a second soldering contact surface, the first soldering contact surface and the second soldering contact surface face in the same spatial direction as the outer surface, and the first soldering contact surface and the second soldering contact surface are set back relative to the outer surface, is arranged in the cutout.