Optoelectronic IC Test Fixture With Multi-Level Optical Coupling

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Solution Overview

Problem

There is a lack of test devices for optoelectronic integrated circuits that can accommodate customized designs, hindering effective testing of these circuits.

Innovation Solution

A test device for optoelectronic integrated circuits featuring multiple light transmission components at varying vertical levels and orientations, including optical fibers and connectors, to facilitate diverse optical coupling configurations, accommodating different circuit designs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single test device is used for optoelectronic integrated circuits, then the device structure is simple, but it cannot accommodate customized designs and different circuit configurations

Engineering Contradiction:
Improveadaptability to different circuit designsVSAvoidtest device structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The test device is designed with multiple light transmission components (first light transmission component, second light transmission component, third light transmission component) that can accommodate different optical coupling configurations. These components include various connectors and optical fibers arranged at different positions and orientations, enabling the same test device to test different optoelectronic integrated circuit designs through selective connection configurations

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces vertical level differentiation with light transmission components positioned at first, second, and third vertical levels relative to the carrier surface. This multi-level spatial arrangement allows optical signals to be transmitted from different directions (side coupling, top coupling) to the optical waveguide, providing versatile testing capabilities without requiring multiple separate test devices

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple light transmission components are added to accommodate different designs, then adaptability improves, but device complexity increases

Engineering Contradiction:
Improveoptical coupling configurationsVSAvoidnumber of light transmission components
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The test device is segmented into multiple independent light transmission components (first light transmission component with first connector, second light transmission component with second connector, third light transmission component with third connector). Each component can be independently configured and connected to the optoelectronic integrated circuit at different positions and orientations, allowing flexible combination to match different testing requirements without requiring complete redesign of the entire test device

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables comprehensive electrical testing of optoelectronic integrated circuits with varied designs by providing flexible optical signal transmission paths, overcoming limitations of single-test equipment.

Implementation Method 1

The first light transmission component further includes a first optical fiber, a first joint, and a first connector... The first optical fiber includes the first transmission portion, the optoelectronic integrated circuit includes a first optical waveguide, and the first optical fiber is parallel to and faces the first optical waveguide

Methodology Applied
Scientific EffectOptical fiber transmission: Optical Fibre

Implementation Method 2

The second connector of the second light transmission component includes a reflective wall arranged at an acute angle with respect to the second optical fiber and the carrier surface... the test optical signal transmitted by the second transmission portion is reflected to the second optical waveguide through the reflective wall

Methodology Applied
Scientific EffectOptical reflection: Reflection

Implementation Method 3

the inclined portion is arranged at an acute angle with respect to the second optical fiber and the carrier surface and comprises a reflective material with a refractive index greater than that of air... the test optical signal transmitted by the second transmission portion is reflected to the second optical waveguide through the inclined portion

Methodology Applied
Scientific EffectOptical refraction: Refraction

Implementation Method 4

The third transmission portion is inclined to the carrier surface and is configured to transmit a test optical signal directly emitted to the third optical waveguide from above the optoelectronic integrated circuit

Methodology Applied
Scientific EffectOptical waveguide coupling: Waveguide (optics)

Data Source

PatentUS12504465B2Test device for optoelectronic integrated circuit
Publication Date: 2025.12.23 CHUNGHWA PRECISION TEST TECH
  • US12504465B2 patent drawing
  • US12504465B2 patent drawing
  • US12504465B2 patent drawing

AI summary

A test device for an optoelectronic integrated circuit includes a circuit board, a connecting base, a first light transmission component, and a second light transmission component. The connecting base is arranged on the circuit board and includes a carrier board and a frame. The optoelectronic integrated circuit is arranged on a carrier surface of the carrier board. The first light transmission component is arranged on a side of the frame, includes a first transmission portion, and is located at a first vertical level with respect to the carrier surface. The second light transmission component is arranged on another side of the frame, includes a second transmission portion, and is located at a second vertical level with respect to the carrier surface. A height of the second vertical level is different from a height of the first vertical level.