Optoelectronic integrated circuit testing devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optoelectronic integrated circuits face challenges in simultaneously measuring electrical and optical signals due to conflicting signal transmission methods, making accurate testing difficult and costly.
Innovation Solution
An optoelectronic integrated circuit testing device that integrates optical fibers and probes through a guide plate module, allowing simultaneous measurement of electrical and optical signals by positioning the optical fibers and probes to prevent misalignment and improve calibration accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate measurement methods are used for electrical and optical signals, then each signal type can be measured independently, but simultaneous measurement of both signal types becomes difficult
Solution Approach 1:
The patent combines electrical probes and optical fibers into a single integrated testing device structure. The probe assembly includes both electrical contact elements and optical fiber components that work together to simultaneously measure both electrical and optical signals from the optoelectronic integrated circuit, eliminating the need for separate measurement systems.
Solution Approach 2:
The testing device is designed with multi-functional capabilities where a single probe assembly can perform both electrical signal measurement through contact probes and optical signal measurement through integrated optical fibers. This universal design allows the device to handle multiple measurement types without requiring separate specialized equipment.
2Manufacturing precision
If optical fibers and probes are positioned without precise alignment, then the structure is simpler, but measurement accuracy deteriorates due to misalignment
Solution Approach 1:
The patent incorporates alignment marks and positioning features that are pre-configured in the device structure before testing begins. These preliminary alignment elements ensure that the optical fibers and electrical probes are correctly positioned relative to the optoelectronic integrated circuit test points, achieving precise alignment without complex real-time adjustment mechanisms.
Solution Approach 2:
The probe assembly acts as an intermediary structure that integrates both optical and electrical measurement components. This intermediate assembly includes built-in alignment features and positioning mechanisms that mediate between the simplified structure requirement and the precise positioning requirement, achieving accurate alignment through the integrated design of the probe assembly itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device simplifies and enhances the accuracy of optoelectronic integrated circuit testing by integrating photoelectric signal measurement, reducing testing costs and manufacturing expenses.
Implementation Method 1
the optical fiber receives optical communication signals transmitted from the optoelectronic integrated circuit
Implementation Method 2
portions where the plurality of probes pass through the guide plate module are respectively provided with a probe elastic portion
Data Source
AI summary
An optoelectronic integrated circuit testing device, configured to test optoelectronic integrated circuits, includes an automated testing equipment; an optical fiber connected to the automated testing equipment respectively; a receiving interface module disposed on the automated testing equipment, wherein the receiving interface module is provided with the optical fiber through hole for the optical fiber to pass through; a plurality of probes, wherein each probe is connected to the receiving interface module; and a guide plate module disposed on the receiving interface module, wherein the plurality of probes and the optical fiber pass through the guide plate module. The plurality of probes pressed against the optoelectronic integrated circuit when testing the optoelectronic integrated circuit, and the optical fiber receives optical communication signals transmitted from the optoelectronic integrated circuit.