Optoelectronic Device Insulator-Embedded Electrical Connectors

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Solution Overview

Problem

The formation of electrical connectors in optoelectronic devices often results in ineffective photoactive layer areas and visible markings, reducing the device's effectiveness and aesthetic appeal, due to the complexity and inefficiency of existing processing methods.

Innovation Solution

The optoelectronic device features separation channels and insulator material extending through the photoactive and conductive layers, with electrical connectors placed inside the lateral extent of the insulator material, allowing for a simpler, cost-effective manufacturing process that minimizes the size and visibility of the connectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional methods are used to form electrical connectors by removing and depositing material, then electrical connectivity between photoactive cells is achieved, but the photoactive layer area is reduced and visible markings are created

Engineering Contradiction:
Improveelectrical connectivityVSAvoidphotoactive layer area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The electrical connector is nested within the insulator material structure. The insulator material forms a raised structure that contains the connector, hiding it within the lateral extent of the insulator material and preventing visible markings while maintaining electrical connectivity between photoactive cells

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The solution moves the connector from a surface-level feature to a subsurface feature by placing it within the insulator material volume. This dimensional relocation eliminates visible markings on the device surface while preserving the electrical connection function

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If conventional connector formation methods are used, then electrical connectivity is established, but processing complexity and cost increase

Engineering Contradiction:
Improveelectrical connectivityVSAvoidprocessing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The formation of the insulator material structure and the electrical connector is merged into a single integrated structure. The connector is formed within the insulator material during the same processing sequence, eliminating separate steps for connector formation and reducing overall processing complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The insulator material structure is formed in advance to define the location and containment structure for the electrical connector. This preliminary formation of the insulator material simplifies subsequent connector formation by providing a pre-defined pathway and structural framework

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS10158033B2Connection of photoactive regions in an optoelectronic device
Publication Date: 2018.12.18 OXFORD PHOTOVOLTAICS LTD
  • US10158033B2 patent drawing
  • US10158033B2 patent drawing
  • US10158033B2 patent drawing

AI summary

An optoelectronic device has a layered construction, comprising a base layer, a first conductive layer, a photoactive layer and a second conductive layer. Plural separation channels extending through the photoactive layer and the first conductive layer separate the photoactive layer into photoactive regions, and insulator material extends through the respective separation channels to the base layer. Between adjacent photoactive regions, electrical connectors extend inside the lateral extent of the insulator material between a surface of a second electrode that is in electrical contact with one photoactive region to an opposing surface of a first electrode that is in electrical contact with the other photoactive region. By forming the electrical connectors extend inside the lateral extent of the insulator material, the overall size of the connection is minimized.