Optoelectronic Component Lateral Contact Insulation

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Solution Overview

Problem

Conventional optoelectronic components lack effective electrical insulation and simple electrical contacting methods, leading to complex integration and reduced optical activity due to metalized contact strips and inadequate heat management.

Innovation Solution

An optoelectronic component is designed with an optically active region electrically coupled to a first contact structure, surrounded by an encapsulation structure formed from an electrically insulating molding compound, which includes a second contact structure for easy electrical connection and mechanical protection, enabling efficient heat spreading.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If metalized contact strips are formed on the carrier to electrically contact the optoelectronic component, then electrical contacting is achieved, but the optically active area is reduced

Engineering Contradiction:

Improveelectrical contactingVSAvoidoptically active area

Core Design Contradiction:

Ease of operationVSArea of stationary object

Solution Approach 1:

The contact structures are positioned at the lateral edges of the optoelectronic component rather than on the optically active surface, utilizing the peripheral dimension for electrical contact while preserving the central optical area

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The encapsulation structure serves as an intermediary that provides electrical contact structures on its outer surface, mediating between the external electrical connection needs and the internal optically active region without direct interference

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional electrical insulation is provided only in the assemblage of multiple components, then manufacturing is simplified, but individual component insulation and compliance with electrical standards are not achieved

Engineering Contradiction:

Improveinsulation provisionVSAvoidelectrical insulation

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The encapsulation structure merges multiple functions: it provides mechanical protection, thermal management, and electrical insulation simultaneously, integrating what were previously separate concerns into a single unified structure

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation structure is designed as a multi-functional element that performs electrical insulation, mechanical protection, and thermal management duties, making the system more versatile and reducing the need for additional separate components

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Device complexity

If the optoelectronic component is designed without integrated encapsulation, then manufacturing steps are reduced, but electrical insulation, mechanical protection, and heat spreading are inadequate

Engineering Contradiction:

ImprovestructureVSAvoidelectrical insulation

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation structure utilizes composite material properties to simultaneously achieve electrical insulation through insulating materials, thermal management through thermally conductive pathways, and mechanical protection through structurally sound design

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides cost-effective electrical insulation, mechanical protection, and simplified electrical contacting, enhancing the integration and performance of optoelectronic components while maintaining optical activity.

Implementation Method 1

an encapsulation structure with a second contact structure... at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

an optically active region which is formed for taking up and/or for providing electromagnetic radiation

Methodology Applied

Scientific EffectElectromagnetic radiation absorption and emission: Absorption (EM radiation)

Implementation Method 3

enabling efficient heat spreading... mechanical protection

Methodology Applied

Scientific EffectMechanical protection: Physical Containment

Implementation Method 4

enabling efficient heat spreading

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS9859524B2Optoelectronic component and method for producing an optoelectronic component

Publication Date: 2018.01.02 DOLYA HOLDCO 5 LTD

AI summary

Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.