Optoelectronic Lid with Anti-Reflective Transparent Wall
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The packaging of optoelectronic devices poses challenges for innovation and cost reduction due to the need for high precision in optical linking between laser diodes, waveguides, and connector units, which is often hindered by environmental factors like humidity and dust.
Innovation Solution
A lid component with an optically transparent wall coated with an anti-reflective material is used to seal active components, manufactured using deep reactive ion etching and adhesively joined to the lid, ensuring proper optical links and environmental protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging is used to protect optoelectronic components from environmental factors, then reliability is improved, but manufacturing precision and optical linking are compromised
Solution Approach 1:
The packaging structure is divided into separate functional components: a lid component for environmental protection and an optically transparent wall for optical transmission. This segmentation allows each component to be optimized independently - the lid provides hermetic sealing while the transparent wall maintains optical precision through anti-reflective coating.
Solution Approach 2:
An optically transparent wall with anti-reflective coating serves as an intermediary between the internal optoelectronic components and the external environment. This intermediary structure allows optical signals to pass through while blocking environmental contaminants, thus protecting components without compromising optical linking.
2Manufacturing precision
If high precision processing is used for optical linking, then optical performance is improved, but device complexity and cost increase
Solution Approach 1:
The patent employs cost-effective materials and simple adhesive bonding techniques instead of expensive precision machining and complex assembly processes. The lid component and transparent wall can be manufactured using conventional methods and joined through adhesion, reducing manufacturing complexity while maintaining optical performance.
Solution Approach 2:
The anti-reflective coating on the transparent wall modifies the optical parameters to reduce reflections and improve transmission. This parameter change (adding coating layer) achieves optical performance improvement without requiring complex mechanical precision in the base structure.
3Reliability
If environmental protection is implemented, then reliability is improved, but optical transmission is blocked
Solution Approach 1:
The packaging structure applies different properties to different regions: the lid component provides hermetic sealing for environmental protection, while the optically transparent wall with anti-reflective coating provides optical transmission. This local differentiation allows simultaneous achievement of both protection and transmission functions.
Solution Approach 2:
The system uses composite construction combining opaque sealing materials (lid) with transparent optical materials (wall with coating). The anti-reflective coating creates a composite optical interface that maintains transmission while the lid provides protective sealing, achieving both environmental protection and optical transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise and hermetic sealing of optoelectronic devices, maintaining optical links while mitigating environmental impacts, thus enhancing device reliability and reducing costs.
Implementation Method 1
The optically transparent wall is coated with an anti-reflective material and configured to interface with a section of the lid component
Implementation Method 2
The optically transparent wall is joined with the section of the lid component
Data Source
AI summary
Techniques and configurations are provided for packaging optoelectronic devices. In particular, a lid component of an optoelectronic device is provided, and the lid component is configured to cover active components of the optoelectronic device. An optically transparent wall is also provided. The optically transparent wall is coated with an anti-reflective material and configured to interface with a section of the lid component. The optically transparent wall is joined with the section of the lid component such that the optically transparent wall and the lid provide a seal for the active components of the optoelectronic device. Additionally, the lid component has a top surface and a plurality of side surfaces that are coupled to the top surface. An optically transparent wall coated with an anti-reflective material adhesively joins to the top surface and one or more side surfaces.