3D Printing Optoelectronic Lighting Devices via Segmented Curing Zones
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Solution Overview
Problem
There is a need for an efficient method to form three-dimensional objects for optoelectronic lighting devices with optoelectronic semiconductor components, as existing methods are limited in producing complex shapes and geometries, and require complex adhesive bonding steps.
Innovation Solution
A 3D printing method involving a carrier with an optoelectronic semiconductor component, where a polymerizable liquid is introduced and exposed to form solid polymers in a curing zone, with an ineffective region inhibiting polymerization, allowing the liquid to flow and form objects rapidly without curing, thus eliminating the need for adhesive bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If UV-curing plastic is exposed by UV light to form three-dimensional objects, then the objects can be formed with complex shapes and geometries, but the production efficiency is limited and complex adhesive bonding steps are required
Solution Approach 1:
The construction region is divided into two distinct zones: a curing zone where polymerization occurs and an ineffective region where polymerization is inhibited. This segmentation allows the polymerizable liquid to remain fluid in the ineffective region for rapid shaping while curing in the desired object regions, thereby improving production efficiency without compromising geometric complexity
Solution Approach 2:
Different regions of the polymerizable liquid are given different properties: the curing zone has properties favorable for polymerization (exposed to UV light), while the ineffective region has properties that inhibit polymerization (protected from UV light or exposed to inhibitor). This local differentiation enables rapid object formation with complex geometries while maintaining high productivity
2Ease of manufacture
If conventional methods are used to form three-dimensional objects, then adhesive bonding steps are required to attach components to the carrier, but this increases production complexity and time
Solution Approach 1:
The formation of the three-dimensional object and its attachment to the carrier are merged into a single simultaneous process. The carrier itself serves as the boundary defining the construction region, and the polymerizable liquid is introduced and cured directly on the carrier surface. This eliminates the need for separate adhesive bonding steps, reducing both production complexity and time
Solution Approach 2:
The carrier is prepared in advance with the optoelectronic semiconductor component arranged on it, and the construction region is pre-defined by the carrier geometry. The polymerizable liquid is then introduced directly into this pre-prepared region and cured in place. This preliminary preparation eliminates the need for subsequent adhesive bonding operations, saving production time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient and flexible production of complex three-dimensional objects for optoelectronic lighting devices, allowing for rapid formation and various shapes, including housing walls, optical waveguides, and lenses, which can be directly connected to the carrier, reducing production time and complexity.
Implementation Method 1
an optoelectronic semiconductor component is arranged on the carrier... exposing the construction region to form one or more solid polymers from the polymerizable liquid
Implementation Method 2
exposing the construction region to form one or more solid polymers from the polymerizable liquid in a curing zone
Implementation Method 3
an ineffective region is formed during the process of exposing the construction region, polymerization being inhibited in the ineffective region
Data Source
AI summary
A method of forming one or more three-dimensional objects for an optoelectronic lighting device including a carrier with an optoelectronic semiconductor component includes providing a carrier of an optoelectronic lighting device, wherein an optoelectronic semiconductor component is arranged on the carrier, and a construction region partly delimited by the carrier is defined, the optoelectronic semiconductor component facing the construction region, introducing a polymerizable liquid into the construction region, and exposing the construction region to form one or more solid polymers from the polymerizable liquid in a curing zone included by the construction region, and one or more three-dimensional objects from the one or more solid polymers in the curing zone, wherein an ineffective region is formed during the process of exposing the construction region, polymerization being inhibited in the ineffective region, and the curing zone is arranged between the carrier and the ineffective region.