Optoelectronic Component Production with Defined Wavelength-Converting Elements
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Solution Overview
Problem
Existing methods for producing optoelectronic components with wavelength-converting elements are costly and result in components without clearly defined outer edges, limiting their integration with optoelectronic semiconductor chips.
Innovation Solution
A method involving a mask layer on the semiconductor chip, a carrier with walls forming a receiving region, filling with optically reflective material, removing the mask layer to create a free space, and introducing a wavelength-converting material into this space, allowing for precise formation and integration of wavelength-converting elements within an optically reflective layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wavelength-converting elements are produced by screen or stencil printing, then production costs are reduced, but the elements do not comprise clearly defined outer edges
Solution Approach 1:
A mask layer is applied to the optoelectronic semiconductor chip before filling with optically reflective material. This mask layer defines the future boundary of the wavelength-converting element and is removed after filling, creating clearly defined outer edges. This preliminary structuring enables precise element boundaries while using cost-effective filling processes.
Solution Approach 2:
The mask layer serves as an intermediary element that temporarily defines the boundary during the manufacturing process. It mediates between the filling process and the final element structure, allowing inexpensive filling methods to produce precisely bounded wavelength-converting elements without requiring expensive precision printing equipment.
2Illumination intensity
If optoelectronic semiconductor chips are embedded into layers of reflective materials, then a stronger luminous flux is achieved, but clearly defined outer edges of wavelength-converting elements are required
Solution Approach 1:
The mask layer is applied beforehand to define the precise boundary where the wavelength-converting element will form. This preliminary definition enables the element to achieve clearly defined outer edges, which is a prerequisite for embedding into reflective material layers to maximize luminous flux extraction.
Solution Approach 2:
The mask layer creates local differentiation on the chip surface, defining a specific region for the wavelength-converting element with precise boundaries. This local quality control ensures that when embedded in reflective layers, the element achieves optimal light extraction without requiring complex precision printing processes.
3Manufacturing precision
If wavelength-converting elements are produced as stamped ceramic small plates, then clearly defined outer edges are achieved, but production costs are high
Solution Approach 1:
The mask layer is a temporary, inexpensive structure applied to the chip surface that defines the element boundary during manufacturing. It is removed after serving its purpose, enabling precise element formation without requiring expensive permanent fixtures or precision printing equipment. This disposable masking approach replaces costly stamped ceramic plates.
Solution Approach 2:
The mask layer acts as an intermediary that enables inexpensive filling processes to produce precisely bounded wavelength-converting elements. It mediates between low-cost filling methods and the requirement for defined outer edges, eliminating the need for expensive stamped ceramic plates while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the inexpensive production of optoelectronic components with clearly defined wavelength-converting elements, optimized size and alignment, and reduced material waste, while allowing for flexible thickness and color locus control, and mechanical protection using an optically transparent casting material.
Implementation Method 1
filling a region of the receiving region surrounding the optoelectronic semiconductor chip with an optically reflective material
Implementation Method 2
the wavelength-converting element respectively converts a wavelength of an electromagnetic radiation emitted by the optoelectronic semiconductor chip to generate electromagnetic radiation such as visible light having one or several different wavelengths
Data Source
AI summary
A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a mask layer arranged on an upper side of the optoelectronic semiconductor chip; providing a carrier having walls arranged on a surface of the carrier, the walls laterally limiting a receiving region; arranging an optoelectronic semiconductor chip in the receiving region, wherein a bottom side of the optoelectronic semiconductor chip faces the surface of the carrier; filling a region of the receiving region surrounding the optoelectronic semiconductor chip with an optically reflective material up to a height that lies between the upper side of the optoelectronic semiconductor chip and an upper side of the mask layer; removing the mask layer to create a free space in the optically reflective material; and introducing a wavelength-converting material into the free space.