Optoelectronic Component Metallization Reflective Layer
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Solution Overview
Problem
Optoelectronic components, such as light emitting diodes, face challenges with absorption losses and material aging due to the absorption of electromagnetic radiation, leading to reduced efficiency and shorter lifespan.
Innovation Solution
The implementation of a composite body with an optoelectronic semiconductor chip embedded in a molded body, featuring an electrically conductive through contact and a second top side metallization that is electrically insulated from the first metallization, which acts as a reflective layer to reduce absorption losses and prevent material aging, while also allowing for the inclusion of a wavelength-converting material to enhance radiation conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the optoelectronic semiconductor chip is embedded into the molded body, then the component achieves compact external dimensions, but absorption losses occur due to electromagnetic radiation absorption by the molded body
Solution Approach 1:
The patent converts the harmful absorption of electromagnetic radiation by the molded body into a beneficial effect by applying a wavelength-converting material. This material absorbs the electromagnetic radiation that would otherwise be lost and converts it into useful light output, transforming the absorption loss into a functional benefit for enhancing light emission.
Solution Approach 2:
The patent uses a composite structure consisting of the molded body combined with a wavelength-converting material layer. This composite material system allows the molded body to provide mechanical support and embedding functionality while the wavelength-converting material layer addresses the absorption loss issue by converting electromagnetic radiation into useful light.
2Volume of moving object
If the optoelectronic semiconductor chip is embedded into the molded body, then the component achieves compact external dimensions, but material aging occurs due to prolonged exposure to electromagnetic radiation
Solution Approach 1:
The wavelength-converting material serves as a protective layer that absorbs harmful electromagnetic radiation before it can cause degradation to the molded body and semiconductor chip. By converting this radiation into useful light, the material prevents aging and extends the component's operational lifespan while maintaining compact dimensions.
3Loss of energy
If a wavelength-converting material is added to reduce absorption losses, then the efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent merges the wavelength-converting material directly with the molded body structure, integrating the light conversion function into the existing housing. This integration approach minimizes additional complexity by combining multiple functions (structural support and wavelength conversion) into a unified component rather than adding separate discrete elements.
Solution Approach 2:
The molded body is designed to serve multiple functions: providing mechanical support, embedding the semiconductor chip, and housing the wavelength-converting material. This multi-functional design reduces overall device complexity by eliminating the need for separate structural and functional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reflectivity and efficiency of the optoelectronic component, reduces absorption losses, and increases the component's lifespan by preventing excessive material aging, while enabling the conversion of electromagnetic radiation into different wavelengths for improved color output.
Implementation Method 1
a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip
Implementation Method 2
a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization
Data Source
AI summary
An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.