3D Imaging Optoelectronic Module Thermal Cradle Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current 3D imaging optoelectronic modules for space applications face challenges in miniaturization, high cost, alignment accuracy, and temperature management, with manual centering being lengthy and inaccurate, and existing cooling solutions being costly and bulky, leading to increased dark current and electronic noise.
Innovation Solution
A 3D imaging optoelectronic module featuring a thermally conductive rigid cradle that integrates mechanical securing, optical alignment, and thermal dissipation, with a frame that includes centring and fixing points for precise alignment and electrical connection, fabricated using a resin-moulded assembly with metallized and etched tracks for interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If manual centring and alignment procedures are used, then device complexity is reduced, but manufacturing precision deteriorates due to positioning inaccuracies of 150 μm and 80 μm
Solution Approach 1:
The cradle is pre-equipped with centring points and alignment features during manufacturing. The chip is positioned on the cradle using these pre-configured reference points, eliminating the need for complex manual centring procedures while achieving high positioning accuracy of 35 μm or better.
Solution Approach 2:
The cradle acts as an intermediary component between the chip packaging process and the final optical assembly. It provides a stable reference framework with built-in centring points that mediates the alignment between the chip's active surface and the optical axis, ensuring precise positioning without direct manual intervention.
2Temperature
If Pelletier heat exchanger and radiator are added for cooling, then temperature management is improved, but device complexity and cost increase
Solution Approach 1:
The cradle integrates multiple functions into a single component: mechanical support for the chip, optical alignment through its reference surface, electrical connection via integrated contacts, and thermal management through its thermally conductive structure. This merging eliminates the need for separate Pelletier heat exchanger and radiator components.
Solution Approach 2:
The cradle is designed as a universal platform that simultaneously provides mechanical fixation, optical alignment, electrical connectivity, and thermal dissipation pathways. This multi-functional design replaces multiple specialized components with a single integrated structure, reducing overall device complexity.
3Measurement precision
If sensor resolution is increased, then imaging quality is improved, but temperature sensitivity increases causing dark current to increase
Solution Approach 1:
The cradle's thermally conductive structure provides passive thermal management that is inherent to the device design. The high-resolution sensor benefits from the cradle's thermal pathways that actively dissipate heat without requiring external cooling systems, allowing the sensor to maintain optimal temperature even as resolution increases and power dissipation rises.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves precise alignment and reduced electronic noise, while providing efficient thermal management and cost-effective manufacturing, enabling improved performance and accuracy in space imaging applications.
Implementation Method 1
the sensor and stack assembly being moulded in a resin... improved thermal conductivity
Implementation Method 2
vertical faces according to Z metallized and etched to form electrical interconnection tracks
Data Source
AI summary
A 3D imaging optoelectronic module intended to be fixed to an image-forming device comprises: an optoelectronic sensor comprising a package with a chip electrically connected to a stack of at least one printed circuit board, the sensor and stack assembly molded in a resin and having faces according to Z with electrical interconnection tracks of the printed circuit boards. It comprises a thermally conductive rigid cradle in the form of a frame having a reference surface according to X, Y and: on a top surface: reference points intended to center and align the image-forming device in relation to the reference surface, fixing points to allow the fixing of the image-forming device, and an inner bearing surface having bearing points of the sensor adjusted to center and align the chip in relation to the reference surface.