Hermetic Optoelectronic Module with Filler Expansion Compensation
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Solution Overview
Problem
Existing optoelectronic modules face issues with filler material expansion due to temperature changes, leading to increased pressure on the cover and carrier element, which can cause cracks and degrade the efficiency of electromagnetic radiation output.
Innovation Solution
A hermetically sealed optoelectronic module with a deformable compensation volume that allows the filler material to expand into, reducing pressure on the carrier and cover elements, and maintaining increased electromagnetic radiation output even with volume changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If filler material is introduced into the encapsulation to increase electromagnetic radiation output, then the output of electromagnetic radiation is improved, but the filler material expands with increasing temperature and exerts pressure on the cover and carrier element, leading to cracks and degradation of efficiency
Solution Approach 1:
The encapsulation volume is segmented into a filler material region and a compensation volume region. The compensation volume acts as a separate compartment that absorbs the thermal expansion of the filler material, preventing it from exerting pressure on the cover and carrier element while allowing the filler material to maintain its light-enhancing function in the remaining volume.
Solution Approach 2:
A compensation volume is pre-established within the encapsulation structure before the filler material expands. This compensation volume serves as a cushion or buffer zone that anticipates and absorbs the volume expansion of the filler material when temperature increases, thereby preventing damage to the encapsulation structure.
2Illumination intensity
If filler material fills the internal volume completely to maximize electromagnetic radiation output, then the light output is increased, but the optoelectronic element may be damaged by the pressure of the filler material when it expands with temperature
Solution Approach 1:
The internal volume is divided into two functional zones: a filler material region that maximizes light output and a compensation volume region that provides protective space for thermal expansion. This segmentation allows the filler material to occupy sufficient volume for optimal light enhancement while preventing complete filling that would cause damage during expansion.
Solution Approach 2:
The compensation volume is designed in advance as a safety buffer that prevents the filler material from exerting damaging pressure on the optoelectronic element during thermal expansion, thereby protecting the structural integrity of the encapsulation.
3Illumination intensity
If the filler material is used to adapt the refractive index and increase light output, then the electromagnetic radiation output is enhanced, but the expansion of the filler material with temperature causes cracks in the cover and significant degradation of efficiency
Solution Approach 1:
The encapsulation space is segmented into a filler material region optimized for light output enhancement and a compensation volume region that absorbs thermal expansion. This segmentation maintains the beneficial refractive index matching effect of the filler material while preventing the formation of cracks that would degrade output efficiency.
Solution Approach 2:
The compensation volume serves as a pre-established buffer that prevents thermal expansion-induced cracks in the cover, thereby maintaining the structural integrity and efficiency of electromagnetic radiation output over temperature variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of damage to the module components and enhances the output of electromagnetic radiation by accommodating filler material expansion, ensuring consistent performance across varying temperatures.
Implementation Method 1
A filler material with which the cavity is at least partially filled and a compensation volume for compensating for an expansion of a volume occupied by the filler material
Data Source
AI summary
An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.


