Optoelectronic Module Frame Routing Electrical Contacts
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Solution Overview
Problem
The arrangement of multiple semiconductor chips in optoelectronic modules for achieving homogeneous luminance is complicated by interconnectability and contactability issues, leading to increased costs and complexity.
Innovation Solution
The use of a frame made of potting compound to enclose semiconductor chips, with contact structures routed over the frame for electrical contacting, allowing for separate optical and electrical functions and enabling testing and reworking before attaching optical elements, and the incorporation of scattering and specular particles in the casting compound to reduce absorption losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple semiconductor chips are arranged on a substrate to achieve homogeneous luminance, then the luminance homogeneity is improved, but the interconnectivity and contactability become more complex and costly
Solution Approach 1:
The patent divides the electrical contact function into separate contact structures that are independently arranged on the substrate. Each semiconductor chip has dedicated contact areas that are electrically contacted through separate conductive paths, allowing independent routing and simplifying the overall interconnection architecture while maintaining luminance homogeneity through proper chip arrangement
Solution Approach 2:
The patent introduces an intermediary layer or structure between the semiconductor chips and the electrical contacts. This intermediary facilitates the electrical connection while allowing optical transparency, thus enabling both homogeneous luminance output and simplified electrical interconnectivity through a mediating element that handles both electrical and optical requirements
2Illumination intensity
If multiple semiconductor chips are arranged on a substrate to achieve homogeneous luminance, then the luminance homogeneity is improved, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple functions into integrated structures. The contact structures serve both electrical contact and optical transmission functions, eliminating the need for separate components. This merging reduces the total number of manufacturing steps and components, thereby reducing manufacturing cost while maintaining homogeneous luminance output
Solution Approach 2:
The patent designs contact structures that perform multiple functions simultaneously: electrical contact, optical transparency, and structural support. This multi-functionality reduces the overall component count and simplifies the manufacturing process, making production more cost-effective while achieving homogeneous luminance across multiple semiconductor chips
3Reliability
If contact structures are applied directly to semiconductor chips, then electrical contactability is improved, but the optical function is compromised due to obstruction of the emissive surface
Solution Approach 1:
The patent applies contact structures only to specific localized areas of the semiconductor chip that are not part of the emissive surface. The contact structures are positioned on the peripheral or back surfaces of the chips, ensuring that electrical contactability is achieved without obstructing the optical emission area, thus maintaining both reliability and illumination intensity
4Productivity
If optical elements are attached before electrical testing, then the assembly process is simplified, but reworking and testing become difficult
Solution Approach 1:
The patent performs electrical testing and contact structure application before attaching optical elements. This preliminary action allows for easy reworking and testing of electrical connections without the obstruction of optical components. Only after electrical functionality is confirmed are optical elements attached, maintaining assembly efficiency while enabling easy reworking when needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies and cost-reduces the contacting process, allows for efficient electrical and optical function separation, and enhances light reflection and scattering, resulting in a more effective and cost-efficient optoelectronic module with homogeneous luminance.
Implementation Method 1
the incorporation of scattering and specular particles in the casting compound to reduce absorption losses
Implementation Method 2
the incorporation of scattering and specular particles in the casting compound to reduce absorption losses
Data Source
Figure 1a
Figure 1b
Figure 2~3
AI summary
An optoelectronic module (202, 204, 206, 208, 210, 212, 214, 216) has at least one semiconductor chip (104) for emitting electromagnetic radiation (118). The semiconductor chip (104) has a layer having a first conductivity (120), in particular a p-conductivity, a layer having a second conductivity (124), in particular an n-conductivity, a radiation surface (108) and a contact surface (106) which lies opposite the radiation surface (108). A contact (110, 117) is attached to the radiation surface (108). A frame (103) made of a potting compound (102) laterally encloses the semiconductor chip (104) in at least some regions such that the radiation surface (108) and the contact surface (106) are substantially free of the potting compound (102). A first contact structure (114) is arranged in at least some regions on the frame (103) and in at least some regions on the contact surface (106) and can be used for electrically contacting the layer having a first conductivity (120). A second contact structure (116, 138) is arranged in at least some regions on the frame (103) and in at least some regions on the contact (110, 117) of the radiation surface (108) and can be used for electrically contacting the layer having a second conductivity (124).