Optoelectronic Module Layout With Separate IC Heat Paths
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Solution Overview
Problem
Integrated optoelectronic modules face challenges in heat dissipation as the degree of integration increases, particularly due to the close proximity required for high-speed signal processing ICs and optical circuit driving ICs, which complicates efficient heat management.
Innovation Solution
The solution involves creating a separate heat dissipation path for each type of IC by housing the IC for driving optical circuits in a depressed portion of the substrate with a filler providing thermal coupling to the substrate, allowing for efficient heat dissipation without interfering with the heat dissipation of the high-speed signal processing IC.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electric IC for driving optical circuit is disposed close to the electric IC for signal processing to reduce module size and wiring length, then the electrical signal wiring region is reduced and signal bandwidth is improved, but heat dissipation design becomes difficult due to the large heat generation from the signal processing IC
Solution Approach 1:
The substrate surface is segmented into a first region for mounting the optical circuit and a second region for mounting the electric ICs, with the first region positioned over the second region. This spatial segmentation allows the optical circuit to be cooled by its own heat dissipation structure while the electric ICs have dedicated heat dissipation paths through the substrate, resolving the heat management issue in compact configurations.
Solution Approach 2:
The patent transitions from planar arrangement to three-dimensional stacking by positioning the optical circuit over the electric ICs in the vertical dimension. This dimensional change enables closer integration without increasing lateral footprint, while maintaining separate heat dissipation paths through the substrate, thus achieving both miniaturization and effective thermal management.
2Speed
If the electric IC for driving optical circuit is disposed close to the electric IC for signal processing to shorten wiring length, then signal bandwidth is improved, but it is difficult to create effective heat dissipation design from the electric IC for driving optical circuit
Solution Approach 1:
The substrate is segmented into functional regions with dedicated heat dissipation structures. The first region (optical circuit) and second region (electric ICs) are spatially separated in the planar domain but integrated in the vertical dimension, allowing each component to have optimized heat dissipation paths without compromising signal bandwidth through short wiring lengths.
3Productivity
If the degree of integration is increased to achieve high-capacity communication equipment, then bit rate per unit volume is improved, but design for heat dissipation becomes difficult
Solution Approach 1:
The integrated module is segmented into distinct functional regions (optical circuit region and electric IC region) with dedicated heat dissipation structures for each. This segmentation enables high integration density while maintaining effective thermal management, as each heat-generating component has its own optimized heat dissipation path through the substrate.
Solution Approach 2:
The patent employs three-dimensional integration by stacking the optical circuit over the electric ICs, achieving high bit rate per unit volume without proportional increases in heat dissipation challenges. The vertical integration allows compact form factor while substrate-based heat dissipation structures manage thermal loads effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective heat dissipation in miniaturized, high-density integrated optoelectronic modules, improving operational stability and reliability by reducing thermal variations and allowing for closer proximity of ICs without compromising heat management.
Implementation Method 1
a bottom surface of the depressed portion is connected to an opposite surface of the first electric IC, the opposite surface being opposite to a connection surface of the first electric IC, with a filler interposed between the depressed portion and the first electric IC
Data Source
AI summary
In an integrated optoelectronic module according to the present disclosure, a heat dissipation path for an electric integrated circuit (IC) for signal processing, which consumes a relatively large amount of power, and a heat dissipation path for an electric IC for driving an optical circuit are separated from each other. The electric IC for driving an optical circuit is mounted on a connection surface of a photonic IC in the state in which a connection surface of the electric IC for driving an optical circuit faces the connection surface of the photonic IC. The electric IC for driving an optical circuit is housed in a depressed portion formed at a portion in a substrate on a connection surface side coupled to a photonic IC. The bottom portion of the depressed portion is thermally coupled to a non-connection surface of the electric IC for driving an optical circuit.