High-Frequency Optoelectronic Module Millimetric Conductors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Modern data centers face challenges in efficiently interconnecting hundreds of thousands of servers due to limited switch port capacity and high power consumption in SerDes interfaces, which restricts bandwidth and increases energy usage.
Innovation Solution
A high-frequency optoelectronic module with a first chip and optoelectronic units that convert high-frequency electrical signals to optical signals and vice versa, using a substrate with conductors of millimetric scale length to reduce energy consumption and enhance bandwidth, incorporating Silicon Photonics circuitry and optical cells operating at various wavelengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the line rate of switch ports is increased to achieve higher bandwidth, then the bandwidth capacity is improved, but the power consumption of SerDes interfaces increases significantly
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission. Optical signals propagate through waveguides with minimal attenuation and interference, eliminating the need for high-power SerDes interfaces. The optical transmission system substitutes the electrical domain with the optical domain, achieving high bandwidth (25.6 Tb/s) with significantly reduced power consumption since optical signals do not suffer from the same signal degradation and retransmission requirements as electrical signals.
Solution Approach 2:
The patent introduces optical waveguides as intermediaries between switch ports. These waveguides serve as the transmission medium, replacing traditional electrical traces and cables. The waveguides enable direct optical coupling between components, eliminating the need for electrical-to-optical conversion at each interface and reducing the power burden on SerDes interfaces while maintaining high bandwidth capacity.
2Productivity
If the number of switch ports is increased to support more servers, then the network capacity is improved, but the package and PCB design complexity increases
Solution Approach 1:
The patent transitions from two-dimensional PCB trace routing to three-dimensional waveguide integration. Multiple optical channels are stacked vertically within the package, allowing dense interconnection of numerous ports without increasing PCB footprint or trace complexity. This vertical stacking approach enables high port counts (256 ports) while maintaining manageable package and PCB design complexity.
Solution Approach 2:
The patent divides the optical interconnection system into modular segments: separate waveguide layers, discrete optical components (lasers, modulators, detectors), and hierarchical routing structures. This segmentation allows independent optimization of each component and simplifies the overall design and manufacturing process, enabling scalable implementation for high port counts without proportionally increasing design complexity.
3Loss of energy
If the conductor length is reduced to millimetric scale, then the signal loss is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent uses standardized waveguide coupling interfaces and repeatable alignment features that can be mass-produced with tight tolerances. Once the coupling geometry is established and validated, it can be copied across all ports and channels, reducing the need for individual manual alignment while maintaining millimetric-scale conductor lengths and minimizing signal loss.
Solution Approach 2:
The waveguide structures incorporate self-aligning features such as mechanical stops, interference fits, or geometric constraints that automatically position components with the required precision during assembly. This self-alignment mechanism reduces dependence on external alignment tools and skilled manual operation, enabling consistent millimetric-scale conductor connections with reduced signal loss while managing manufacturing precision requirements through design rather than process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces power consumption and enhances bandwidth, enabling efficient high-frequency signal exchange while managing traffic of up to 25.6 Tb/s with reduced energy expenditure.
Implementation Method 1
The at least one optoelectronic circuit may be configured to (a) convert high-frequency output electrical signals from the first chip to high-frequency output optical signals
Implementation Method 2
convert high-frequency input optical signals sent towards the first chip to high-frequency input electrical signals
Data Source
AI summary
A high-frequency optoelectronic module, that includes a first chip, a substrate and at least one optoelectronic unit. The first chip includes a set of high-frequency electrical IO interfaces. The at least one optoelectronic unit includes a group of high-frequency electrical IO interfaces and a group of high-frequency optical IO interfaces. The group of high-frequency optical IO interfaces is coupled to the group of high-frequency electrical IO interfaces. The substrate is coupled to the first chip and the at least one optoelectronic chip. The set of high-frequency electrical IO interfaces is coupled to the group of high-frequency electrical IO interfaces via a group of conductors. A length of each conductor of the group of conductors is of a scale that does not exceed a millimetric scale. The at least one optoelectronic circuit is configured to (a) convert high-frequency output electrical signals from the first chip to high-frequency output optical signals, and (b) convert high-frequency input optical signals sent towards the first chip to high-frequency input electrical signals. The high-frequency it not smaller than one hundred gigabits per second.