Optoelectronic Module Structured Mounting Attachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optoelectronic modules face challenges in precisely and simply positioning optical elements relative to light-emitting diode chips, which is crucial for achieving desired radiation characteristics in applications like automobile headlights.
Innovation Solution
An optoelectronic module design featuring a mounting attachment with structured surfaces that allows for exact positioning of optical elements relative to light-emitting diode chips, using materials that are transparent to visible light and potentially opaque for thermal conductivity, with complementary structuring for precise alignment and attachment methods like adhesives or form-fitting connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If optical elements are positioned using attachments as in prior art (DE 100 53 569 A1, US 2007/0 235 743 A), then the optical elements can be mounted, but the positioning process becomes complex and time-consuming
Solution Approach 1:
The patent combines the positioning function and mounting function into a single integrated attachment structure. The attachment includes positioning elements that directly engage with corresponding features on the optical element, eliminating the need for separate positioning and mounting steps used in prior art.
Solution Approach 2:
The attachment is divided into distinct functional components: positioning elements for precise alignment and mounting features for secure attachment. This segmentation allows each component to be optimized for its specific function while simplifying the overall positioning process.
2Reliability
If additional metal sleeves or complex coupling mechanisms are used to connect optical elements (as in US 2005/062055 A1), then connection is achieved, but the device complexity and assembly time increase
Solution Approach 1:
The attachment structure is pre-configured with positioning elements and mounting features during manufacturing. This preliminary preparation eliminates the need for complex assembly operations involving metal sleeves or multi-step coupling processes, allowing for quick and reliable installation.
3Manufacturing precision
If optical elements are positioned with high precision relative to LED chips, then desired radiation characteristics are achieved, but the positioning and mounting process becomes more difficult
Solution Approach 1:
The attachment structure incorporates self-aligning features where positioning elements automatically guide the optical element into the correct position relative to the LED chips. This self-service mechanism eliminates the need for complex external positioning tools or procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy, precise, and technically simple positioning of optical elements, allowing for high luminance and efficient light emission while facilitating easy retrofitting and minimizing light reflection, thus improving the performance of light sources in projection devices.
Implementation Method 1
The mounting attachment preferably contains a material that has a high thermal conductivity. As a result, the light-emitting diode chips can be well cooled.
Implementation Method 2
The mounting attachment is permeable at least in its transmission area for electromagnetic radiation from the spectral range of visible light.
Data Source
Figure 1
Figure 2A~2B
Figure 3A~4
AI summary
An optoelectronic module (1) is specified, wherein a plurality of light-emitting diode chips (2) are arranged on a carrier (3). A transparent mounting attachment (4) is fitted above the light-emitting diode chips (2), and serves for the positioning of an optical element (5). For this purpose, there are formed on the top side of the mounting attachment (4) structurings (63) into which complementary structurings of the optical element (5) can be fitted. An optoelectronic arrangement (8) comprising a mounting attachment (4) and an optical element (5) is furthermore specified. By way of example, an arrangement (8) of this type is part of a motor vehicle headlight.