Optoelectronic Module With Multi-Height Optical Channels
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Solution Overview
Problem
Existing optoelectronic modules face challenges in optimizing separate light emission and detection channels with differing optical requirements, such as varying focal lengths and material transparency, which can lead to optical cross-talk and stray light issues.
Innovation Solution
The fabrication of optoelectronic modules involves using transmissive covers at different heights and materials for light emission and detection channels, along with non-transparent spacers and baffles to reduce cross-talk, and employing wafer-level processes for efficient production, including replication and vacuum injection techniques to form lenses and other optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate light emission and detection channels are provided with different optical requirements, then optical performance for each channel is improved, but optical cross-talk between channels occurs
Solution Approach 1:
The module is divided into separate emission and detection channels with distinct optical paths. The emission channel includes a light emitter and its dedicated optics member, while the detection channel includes a light detector and its dedicated optics member. This segmentation allows each channel to be optimized independently while preventing optical cross-talk through physical separation.
Solution Approach 2:
Different optical characteristics are applied to different regions of the module. The emission channel uses optics members with properties optimized for light emission (such as specific focal lengths and transparency), while the detection channel uses optics members with properties optimized for light detection. This local differentiation improves overall optical performance while maintaining channel isolation.
2Adaptability or versatility
If optics members are positioned at different heights above the substrate, then optical design flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The patent positions optics members at different heights (vertical dimension) above the substrate rather than only varying their lateral positions. This vertical arrangement provides additional degrees of freedom for optical design, allowing independent optimization of emission and detection optical paths while maintaining a compact planar footprint that simplifies manufacturing.
Data Source
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AI summary
An optoelectronic module has multiple optical channels each of which includes a respective optical element at a different height within the module. The modules can include channels arranged side-by-side where each channel is covered by a respective cover that is optically transmissive to one or more wavelengths of light emitted by or detectable by the optoelectronic devices in the module. The transmissive covers, which respectively can include one or more passive optical elements on their surfaces, are disposed at different heights within the module.