Optoelectronic Module Planar Contacting Height Reduction
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Solution Overview
Problem
Conventional optoelectronic modules face challenges in miniaturization, particularly in reducing the base area while maintaining a low overall height, due to the need for integrated conductive structures for electrical contacting, which hinder a compact arrangement of radiation-emitting semiconductor components.
Innovation Solution
The use of structured conductor tracks on a carrier substrate with electrically insulating layers and conductive structures that connect radiation-emitting semiconductor components to each other or the substrate, allowing for planar electrical contacting and reducing the module's height and base area, while enabling close integration of optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding and soldering are used for electrical contacting, then electrical connection is achieved, but the overall height of the module increases
Solution Approach 1:
The patent extracts the electrical contacting function from the conventional wire bonding/soldering process and relocates it to the carrier substrate level. Conductive structures are integrated directly into the carrier substrate, eliminating the need for separate wire bonding steps and reducing the vertical space required for electrical connections.
Solution Approach 2:
The patent transitions from three-dimensional wire bonding (routing wires through space above the substrate) to a two-dimensional planar conductive structure layout. The conductive structures are arranged in the plane of the carrier substrate, eliminating the vertical height component and enabling a flatter module profile.
2Length of stationary object
If planar contacting is used to reduce component height, then overall height is reduced, but the base area cannot be reduced due to integrated conductive structures
Solution Approach 1:
The patent merges the functions of the carrier substrate, conductive structures, and insulation into a single integrated structure. The conductive structures are formed as part of the carrier substrate itself, eliminating the need for separate components and reducing the overall base area footprint.
Solution Approach 2:
The carrier substrate serves multiple functions simultaneously: it provides mechanical support, electrical insulation, electrical connection pathways, and structural integration for the semiconductor components. This multi-functionality reduces the number of separate components needed and minimizes the base area.
3Reliability
If conductive structures are integrated into the carrier substrate, then electrical insulation is achieved, but the arrangement of semiconductor components becomes more complex
Solution Approach 1:
The patent segments the conductive structures into distinct regions and pathways within the carrier substrate, with each segment serving a specific electrical connection function. This segmentation allows for systematic routing of electrical connections while maintaining clear insulation boundaries, simplifying the overall arrangement.
Solution Approach 2:
The carrier substrate exhibits different local properties in different regions: some areas are conductive for electrical connections, while other areas are insulating for electrical isolation. This spatial variation in material properties allows for efficient electrical routing without requiring complex external insulation structures.
Data Source
Figure 1~3
Figure 4~6
Figure 7A~7C
AI summary
The invention relates to an optoelectronic module, which comprises a carrier substrate (1) and a plurality of radiation-emitting semiconductor components (2). The carrier substrate (1) comprises structured traces. Each radiation-emitting semiconductor component (2) has an active layer (2a) suited for generating electromagnetic radiation, a first contact surface (21), and a second contact surface (22), wherein the first contact surface (21) is disposed on the side of the radiation-emitting semiconductor components (2) facing away from the carrier substrate (1). The radiation-emitting semiconductor components (2) are provided with an electrically insulating layer (4), which has a recess in a region of the first contact surface (21). Conductive structures (8) are arranged in regions on the electrically insulating layer (4). One of the conductive structures (8) connects at least the first contact surface (21) of a radiation-emitting semiconductor component (2) to a further first contact surface (21) of a further radiation-emitting semiconductor component (2) or to a trace of the carrier substrate (1) in an electrically conductive manner. Furthermore, a method for producing such a module is provided.