Optoelectronic Module With Segmented Hermetic Seal and Flexible Substrate
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Solution Overview
Problem
Hermetically sealed packaging for optoelectronic components in fiber optic communication systems provides protection but lacks flexibility for additional functionality and efficient production, while being air-tight, which can hinder the integration of advanced features like hot pluggable optical fiber applications and efficient moisture barrier solutions.
Innovation Solution
A non-hermetically sealed optoelectronic module design utilizing a flexible substrate, moisture barrier, and attachment member made from polymeric materials, which allows for efficient production and provides substantial protection against moisture while enabling features like hot pluggable optical fiber connections and optical isolators to prevent back reflections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetically sealed packaging is used to protect optoelectronic components, then protection against environmentally induced failures is improved, but flexibility for additional functionality and production efficiency deteriorates
Solution Approach 1:
The hermetic seal is segmented into multiple sections: a first hermetic seal between the TO can and base, and a second hermetic seal between the TO cap and base. This segmentation allows the electrical connection portion to remain hermetically sealed while the optical portion can be configured for additional functionalities like hot-pluggable connections and optical isolators.
Solution Approach 2:
Different portions of the packaging have different sealing qualities. The electrical connection area maintains full hermetic sealing for reliability, while the optical fiber interface area uses a non-hermetic configuration to enable hot-pluggable functionality and integration of optical isolators, achieving local optimization of both reliability and adaptability.
2Reliability
If hermetically sealed packaging is used to protect optoelectronic components, then protection against environmentally induced failures is improved, but production efficiency deteriorates
Solution Approach 1:
The packaging is divided into modular sections (TO can, base, TO cap) that can be assembled separately and then combined. This modular approach allows for more efficient production processes compared to traditional single-piece hermetic sealing, while maintaining protection through the segmented hermetic seals at critical interfaces.
3Adaptability or versatility
If non-hermetically sealed design is used to enable additional functionality, then flexibility for additional features is improved, but protection against moisture deteriorates
Solution Approach 1:
The packaging provides local hermetic protection at critical interfaces (electrical connections) while allowing non-hermetic access at the optical fiber interface. This localized approach enables moisture protection where needed while permitting additional features like hot-pluggable connections and optical isolators where environmental protection is less critical.
Solution Approach 2:
The TO cap acts as an intermediary structure that provides mechanical protection and mounting for optical components without requiring full hermetic sealing. It enables the integration of optical isolators and hot-pluggable fiber interfaces while the hermetic seals at the base provide moisture protection for the sensitive electrical connection areas.
Data Source
AI summary
An optoelectronic module for data communication through an optical fiber. The optoelectronic module may comprise a base, an outer cap, an inner cap, a flexible substrate, an attachment member, a moisture barrier and an optoelectronic module. The outer cap may have a first cavity and coupled with the base. A slit may be formed on the outer cap. The flexible substrate may be extended through the slit of the outer cap. The inner cap may be disposed within the first cavity. The inner cap may comprise a second cavity. The attachment member may be disposed within the first cavity and configured to attach the inner cap to the base. The moisture barrier may be disposed within the first cavity and encapsulates the attachment member. The optoelectronic component may be disposed within the second cavity and proximate to the flexible substrate.