Optoelectronic Module Sidewall Shielding for Light Leakage Control
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Solution Overview
Problem
Optoelectronic modules in devices like smartphones face challenges in reducing light leakage from light sources and preventing stray light from entering or exiting through the transparent cover, which can be undesirable for proper functionality.
Innovation Solution
The use of non-transparent materials on the exterior sidewalls of the transparent cover, combined with spacer elements and optical elements like lenses or filters, helps to minimize light leakage and stray light ingress/egress, achieved through vacuum injection and replication techniques during the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a transparent cover is used for the optoelectronic module, then light transmission is improved, but light leakage and stray light ingress occur through the sides of the cover
Solution Approach 1:
The transparent cover is segmented into different functional zones: the top surface remains transparent for light transmission, while the sidewalls are divided into transparent and non-transparent portions. This segmentation allows the cover to simultaneously transmit light from above while blocking light leakage and stray light through the sides.
Solution Approach 2:
Different portions of the cover have different optical properties. The top surface maintains high transparency for light transmission, while the sidewalls incorporate non-transparent materials or structures in specific regions to block unwanted light paths. This local differentiation of optical quality resolves the contradiction between transmission and leakage prevention.
2Object-generated harmful factors
If non-transparent material is added to cover sidewalls, then light leakage is reduced, but device complexity increases
Solution Approach 1:
The non-transparent sidewall portions are merged with the transparent cover to form a single integrated component. Rather than adding separate shielding elements, the cover itself is designed with integrated non-transparent regions, reducing assembly steps and structural complexity while maintaining light leakage prevention.
Solution Approach 2:
The cover utilizes composite material structures combining transparent and non-transparent materials in a single component. This composite approach allows the sidewalls to provide both structural support and optical filtering functions without requiring multiple separate parts, thereby reducing device complexity.
3Object-generated harmful factors
If non-transparent material is applied to sidewalls, then stray light prevention is improved, but manufacturing complexity increases
Solution Approach 1:
The non-transparent material is applied to the sidewalls during the initial cover formation process, before final assembly. By incorporating the non-transparent portions during the preliminary manufacturing stage, subsequent assembly steps are simplified, and the overall manufacturing complexity is reduced despite the additional material application step.
Solution Approach 2:
The non-transparent sidewall material serves multiple functions: it blocks stray light, provides structural support for the cover, and can be integrated with mounting features. This multi-functionality reduces the need for additional separate components, thereby simplifying the overall manufacturing process despite the specialized material requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces light leakage and stray light issues, enhancing the performance and reliability of optoelectronic modules by ensuring that light is directed correctly through the module, improving image quality and sensor accuracy.
Implementation Method 1
Non-transparent material is provided on the exterior sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module
Implementation Method 2
A vacuum injection technique is used to cover sidewalls of each of the singulated transparent substrates with a non-transparent material, and spacer elements are formed that project away from the support surface
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.