Optoelectronic Module Packaging With Nested Thermal Paths
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Solution Overview
Problem
Existing optoelectronic modules face challenges in ensuring all components operate within an acceptable temperature range and providing reliable electrical connections.
Innovation Solution
The optoelectronic module design includes a substrate with a thermal conductivity greater than 10 W/m/K, conductive traces, and a frame composed of a thermally conductive material, along with a carrier and thermal vias to manage heat, and uses wire bonds and flip-chip connections for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive frame and substrate are used to manage heat, then thermal management effectiveness is improved, but device complexity increases
Solution Approach 1:
The frame is secured within a pocket of the substrate, creating a nested structure where the thermally conductive frame is embedded in the substrate. This nesting approach integrates thermal management functionality without requiring separate external heat sinks or complex mounting structures, thus improving thermal management while controlling device complexity.
Solution Approach 2:
The substrate and frame are combined into an integrated thermal management system where the frame is secured in the substrate pocket. This merging of components creates a unified thermal pathway from the photonic integrated circuit through the frame to the substrate, improving heat dissipation efficiency while reducing the number of separate thermal management components needed.
2Productivity
If multiple integrated circuits and optical components are integrated in one module, then productivity is improved, but reliability decreases due to temperature management challenges
Solution Approach 1:
Different regions of the module are assigned different thermal management characteristics. The frame provides high thermal conductivity pathways for heat-generating components like the photonic integrated circuit, while the substrate provides structural support and additional thermal management. This localized thermal management approach allows high-density integration while maintaining reliable operation of each component within its acceptable temperature range.
Solution Approach 2:
The frame acts as an intermediary thermal management component between the photonic integrated circuit and the substrate. It provides a dedicated thermal pathway that mediates heat transfer from the sensitive optical components to the substrate, enabling close integration of multiple components while protecting them from excessive heat through the intermediary thermal conduction path.
3Temperature
If thermal vias and conductive traces are added to the substrate, then heat conduction is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides structural support for the module, acts as a thermal management component through its thermal conductivity and integrated traces, and provides electrical interconnection through conductive traces. This multi-functionality allows the substrate to handle heat conduction without requiring completely separate thermal management structures, thereby improving heat conduction while limiting the increase in manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures effective thermal management and reliable electrical connections, allowing for stable operation of integrated circuits and optical components, with separate testability of subassemblies and controlled temperature regulation.
Implementation Method 1
a frame, secured in a pocket of the substrate, the pocket being in a lower surface of the substrate, the frame being composed of a material having a thermal conductivity greater than 10 W/m/K
Implementation Method 2
the carrier including an insulating layer and a plurality of thermal vias forming a thermal path from the analog integrated circuit to the frame
Implementation Method 3
the substrate further includes a copper layer on a surface of the pocket parallel to the lower surface of the substrate
Data Source
AI summary
An optoelectronic module. In some embodiments, the optoelectronic module includes a substrate; a digital integrated circuit, on an upper surface of the substrate; a photonic integrated circuit, secured in a pocket of the substrate, the pocket being in the upper surface of the substrate; and an analog integrated circuit, on the photonic integrated circuit.