Optoelectronic Module Thermal Segmentation
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Solution Overview
Problem
Designing optoelectronic modules that ensure all components operate within an acceptable temperature range and provide reliable electrical connections while integrating photonic and electronic circuits is challenging.
Innovation Solution
The optoelectronic module includes a substrate with an insulating layer and conductive traces, a frame with high thermal conductivity, and a carrier with thermal vias, along with wire bonds and a heater to manage temperature and electrical connections between photonic, analog, and digital integrated circuits, and an optical fiber secured in a V-groove on the photonic integrated circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a frame with high thermal conductivity is used, then thermal management is improved, but device complexity increases
Solution Approach 1:
The module is divided into distinct functional regions: a first region housing the photonic integrated circuit with its heater and thermal isolation, and a second region housing the digital integrated circuit with its thermal conduction path to the frame. This segmentation allows different thermal management strategies in different areas, resolving the contradiction by providing effective thermal control without requiring the entire device to be complex.
Solution Approach 2:
Different regions of the device have different thermal properties: the photonic circuit region has thermal isolation (low thermal conductivity) to maintain stable temperature, while the digital circuit region has thermal conduction (high thermal conductivity) to the frame for heat dissipation. This local differentiation of thermal quality allows each component to operate within its optimal temperature range without requiring uniform complex thermal management across the entire device.
2Reliability
If separate testing of subassemblies is enabled, then reliability is improved, but device complexity increases
Solution Approach 1:
The device is segmented into separable subassemblies: the photonic integrated circuit with its carrier and the digital integrated circuit with its carrier, which can be tested independently before final assembly. This segmentation enables separate testing of each subassembly's functionality, improving reliability by allowing early detection and correction of defects without requiring complex integrated testing of the complete assembled device.
3Temperature
If thermal isolation is provided for the photonic integrated circuit, then temperature stability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The thermal management system is segmented into isolated thermal zones: the photonic integrated circuit has its own isolated thermal environment with a heater for precise temperature control, while the digital integrated circuit has a separate thermal path to the frame for heat dissipation. This segmentation allows the photonic circuit to maintain temperature stability without being affected by heat from digital circuits, while each region can independently manage its heat dissipation needs.
Solution Approach 2:
Different thermal qualities are applied locally: the photonic circuit region has low thermal conductivity materials and thermal isolation structures to maintain stable temperature, while the digital circuit region has high thermal conductivity paths to the frame for efficient heat dissipation. This local differentiation resolves the contradiction by allowing thermal isolation where needed for stability while maintaining heat dissipation capability where needed for power management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures effective thermal management and electrical connectivity, allowing the module to operate within a stable temperature range and enabling separate testing of subassemblies, thereby improving the reliability and performance of the optoelectronic module.
Implementation Method 1
a frame, secured in a pocket of the substrate, the pocket being in a lower surface of the substrate, the frame being composed of a material having a thermal conductivity greater than 10 W/m/K
Implementation Method 2
the carrier including an insulating layer and a plurality of thermal vias forming a thermal path from the analog integrated circuit to the frame
Implementation Method 3
a heater, in or on the photonic integrated circuit
Data Source
AI summary
An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.