Optoelectronic Module With TSV and Light-Guiding Structure
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Solution Overview
Problem
Current optoelectronic modules face challenges in integrating optical connectors and fiber assemblies in thin electronic devices, leading to difficulties in accurate signal transmission and repeated assembly, which affects performance and convenience.
Innovation Solution
An optoelectronic module is designed with a substrate having a through silicon via (TSV) and a light-guiding structure, integrating a control unit and optoelectronic device, allowing for bidirectional optical signal transmission without wire bonding, using a substrate with a concave structure and reflection surfaces for efficient light guidance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional molding method or stamping technology is used to manufacture connectors, then electrical connection and signal transmission can be achieved, but the device becomes too bulky and cannot meet the light-thin design trend
Solution Approach 1:
The patent replaces traditional mechanical electrical connectors (molding method or stamping technology) with an optoelectronic integration approach. The optical coupling element integrates optical signals and electrical signals into a single compact structure, eliminating the need for separate bulky electrical connectors while maintaining both optical and electrical connection functions.
2Reliability
If fiber is assembled into optical coupling element, then optical signal transmission can be achieved, but assembly accuracy is difficult to control and transmission errors occur
Solution Approach 1:
The patent merges the optical coupling function and electrical connection function into a single integrated optoelectronic module. The optical coupling element is integrated with electrical connection terminals and control circuits on the same substrate, eliminating the need for separate fiber assembly processes and reducing alignment complexity.
Solution Approach 2:
The patent introduces an integrated optoelectronic substrate as an intermediary platform that simultaneously supports optical coupling elements, electrical terminals, and control circuits. This intermediary structure provides precise positioning features that automatically align optical fibers with coupling elements, eliminating manual alignment errors.
3Adaptability or versatility
If optical fiber is fixed within optical coupling element, then optical connection can be established, but repeated assembly and removal cannot be performed
Solution Approach 1:
The patent implements a dynamic, reusable optical connection interface where the optical coupling element is designed to accept and release optical fibers multiple times. The integrated optoelectronic module includes a standardized interface that allows repeated insertion and removal of optical connectors, enabling flexible assembly and disassembly operations.
4Speed
If wire bonding is used to connect chip and laser device, then electrical connection can be achieved, but transmission speed is impacted
Solution Approach 1:
The patent replaces traditional wire bonding mechanical connection method with direct electrical contact through integrated circuit traces and contact pads on the substrate. This substitution eliminates the inductance and resistance introduced by wire bonds, enabling higher signal transmission speeds while reducing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the performance of optical connectors by enabling high-frequency, high-speed transmission and simplifying device assembly, reducing electromagnetic interference and structural errors, while allowing for direct integration of IC and VCSEL/PD without wire bonding.
Implementation Method 1
a light-guiding structure (107)
Implementation Method 2
a micro-reflection surface having a 45 degree angle
Data Source
AI summary
The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.