Optoelectronic Package Structure With Blocking Region for PIC Protection
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Solution Overview
Problem
Chip-on-chip (CoC) packages face signal integrity issues due to high resistance and long transmission paths in wire bonding, limiting high-speed data rates, and optoelectronic devices struggle with contamination and damage during integration, especially when stacking electronic ICs and photonic ICs with additional optical devices.
Innovation Solution
An optoelectronic package structure featuring a photonic component with an electrical connection region, a blocking region, and a region for accommodating an optical device, where the blocking region prevents filling material from overflowing into the optical device area, ensuring precise filling and protecting the optical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect stacked electronic components, then electrical connection is achieved, but signal integrity deteriorates due to high resistance and long transmission path
Solution Approach 1:
The patent transitions from planar wire bonding to three-dimensional vertical interconnection through through-silicon via (TSV) technology. Electrical connections are established by penetrating vertically through the substrate via conductive plugs and metallization layers, dramatically shortening the transmission path from horizontal to vertical dimension and improving signal integrity at high frequencies.
Solution Approach 2:
The patent introduces intermediate conductive structures including through-silicon via plugs, barrier layers, and metallization layers that mediate electrical connections between stacked components. These intermediary elements provide low-resistance vertical pathways, replacing high-resistance wire bonds and enabling reliable high-speed signal transmission through the substrate.
2Adaptability or versatility
If additional optical devices are integrated with PIC, then optoelectronic device functionality is enhanced, but PIC becomes more vulnerable to contamination and damage before integration
Solution Approach 1:
The patent performs preliminary protective action by configuring blocking structures and defining region boundaries before optical devices are integrated with the photonic component. This preliminary arrangement ensures that when filling material is applied, it cannot overflow to contaminate or damage the optical devices during subsequent integration processes, thereby protecting PIC reliability before integration occurs.
Data Source
AI summary
An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.