Optoelectronic Device Package Passive Alignment Thermal Management
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Solution Overview
Problem
High temperature and thermal issues in optoelectronic devices, particularly in fiber-coupled light transmission systems, lead to inefficiencies and potential malfunctions due to alignment challenges and thermal stress, especially in high-power applications where temperature differences cause increased thermal resistance and stress on semiconductor devices.
Innovation Solution
A high temperature optoelectronic device package with passive alignment and a substrate design that includes a patterned thermal conductivity substrate, a glass seal, and a housing with a ferrule-seating portion, allowing for efficient coupling of optical fibers to optoelectronic devices while minimizing thermal resistance and enabling operation at elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment procedures are used to align light output from optical fiber to optoelectronic device, then alignment precision is improved, but manufacturing complexity and time increase significantly
Solution Approach 1:
The patent implements preliminary alignment features directly into the mold during manufacturing. Alignment marks, registration features, and pre-positioned optical components are incorporated into the mold cavity itself, allowing the optoelectronic device and optical fiber to be aligned passively without requiring active alignment procedures during assembly. This eliminates the need for complex active alignment equipment and procedures while maintaining high alignment precision.
2Ease of manufacture
If multiple bonding surfaces and interfaces are used in device packaging, then device assembly is enabled, but thermal resistance increases
Solution Approach 1:
The patent merges multiple bonding surfaces and interfaces into a single integrated mold structure. The mold combines the device housing, mounting surfaces, and optical alignment features into one monolithic component, eliminating multiple separate bonding interfaces. This single-integration approach maintains ease of manufacture through mold-based production while dramatically reducing thermal resistance by removing intermediate bonding layers that impede heat flow.
3Stability of the object's composition
If temperature differences between semiconductor die and case mounting are reduced, then thermal stress is decreased, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs composite material construction in the mold, incorporating high-thermal-conductivity materials in strategic locations to equalize temperature distribution. The mold structure integrates materials with different thermal properties to create optimized thermal pathways that conduct heat away from the semiconductor die uniformly, reducing thermal stress while maintaining manufacturability through standard mold-based processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the assembly process through passive alignment, reduces thermal resistance, and enhances the operational efficiency and reliability of optoelectronic devices at high temperatures, preventing malfunctions and ensuring efficient photon collection and electrical energy conversion.
Implementation Method 1
Photons of the light excite electrons within the optoelectronic device, promoting said electrons across a band-gap, and produce a net difference or voltage in the optoelectronic device. This net difference is the output electrical energy.
Implementation Method 2
A high temperature optoelectronic device package with passive alignment and a substrate design that includes a patterned thermal conductivity substrate
Data Source
AI summary
A high temperature optoelectronic device package includes a substrate, an optoelectronic die situated on an upper surface of the substrate, a seal surrounding the optoelectronic die and situated on the upper surface of the substrate and a housing disposed on the seal having a ferrule-seating portion. The housing is disposed on the seal such that a fiber optic center of the ferrule-seating portion is aligned with an active portion of the optoelectronic die. The optoelectronic die is in operative communication with electronic traces of the substrate.