Optoelectronic Package Layout Without High-Aspect-Ratio Vias
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Solution Overview
Problem
In existing optoelectronic package structures, the vertical arrangement of the processing unit, carrier, and photonic engine with long electrical paths through high-aspect-ratio vias leads to signal distortion and increased package size due to the thick carrier, hindering high-speed transmission and reliability.
Innovation Solution
The optoelectronic package structure embeds the electronic component within a carrier's cavity, reducing the carrier thickness between the processing unit and electronic component, eliminating the need for high-aspect-ratio vias and minimizing package size, with power and signal paths configured to enhance electrical communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a thick carrier is used to support the vertical arrangement of ASIC and optoelectronic device, then structural stability is improved, but electrical connection reliability deteriorates due to long electrical path
Solution Approach 1:
The patent transitions from a conventional vertical stacking arrangement to a lateral planar arrangement where the optoelectronic device is positioned beside the ASIC rather than above it. This dimensional change allows electrical connections to be made through shorter lateral paths on the carrier surface, reducing signal degradation while preserving the carrier's structural stability through its continued role as the supporting substrate.
2Device complexity
If vertical arrangement with thick carrier is adopted, then package structure is simplified, but signal transmission speed deteriorates due to long electrical path
Solution Approach 1:
The patent reconfigures the package layout from vertical stacking to a lateral planar arrangement, positioning the optoelectronic device adjacent to the ASIC on the same carrier plane. This enables shorter electrical connection paths that improve signal transmission speed, while the carrier maintains its function as the structural platform, preserving packaging simplicity.
3Reliability
If high-aspect-ratio vias are used for vertical electrical connection, then electrical connection is achieved, but signal distortion increases and manufacturing difficulty increases
Solution Approach 1:
The patent eliminates the need for high-aspect-ratio vias by extracting the vertical connection requirement from the design. Instead of forcing electrical connections through the thickness of the carrier via high-aspect-ratio vias, the invention repositions components to enable lateral connections on the carrier surface, thereby removing the source of signal distortion and manufacturing complexity associated with high-aspect-ratio vias.
4Ease of manufacture
If vertical arrangement with thick carrier is used, then component mounting is simplified, but package size increases
Solution Approach 1:
The patent transitions from a vertical stacking configuration that increases package height to a lateral planar configuration that reduces overall package volume. By positioning components side-by-side on the carrier rather than stacking them vertically, the invention achieves compact packaging while maintaining ease of manufacture through standard carrier-based mounting processes.
Data Source
AI summary
An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.