Optoelectronic Package Recess Structure for Optical Portion Protection

Solution Overview

Problem

Optical portions of photonic components in optoelectronic packages are prone to damage or contamination during manufacturing processes due to their exposure and interaction with manufacturing materials and processes.

Innovation Solution

Incorporating a recessed portion in the carrier structure to house the optical portion of the photonic component, which overhangs the carrier, and using a supportive structure with an extension to protect the optical portion during handling and assembly, along with a blocking structure to prevent contamination from underfill materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the optical portion is exposed on the carrier surface for easy access, then ease of operation is improved, but the optical portion is prone to damage and contamination during manufacturing

Engineering Contradiction:

Improveaccess to optical portionVSAvoiddamage and contamination resistance

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The optical portion is nested within a recessed region of the carrier, creating a protective cavity that shields the optical components from external damage and contamination while maintaining accessibility for manufacturing operations

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The recessed region is pre-formed in the carrier before the optical portion is placed, establishing a protective structure in advance that prevents damage during subsequent handling and assembly operations

Inventive Principle:

Principle #10Preliminary action

2Device complexity

If the optical portion overhangs the carrier edge for simplified structure, then device complexity is reduced, but manufacturing precision and protection are compromised

Engineering Contradiction:

Improvecarrier structureVSAvoidoptical portion protection

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The optical portion is nested within a recessed region of the carrier, creating a protective cavity that shields the optical components from external damage and contamination while maintaining accessibility for manufacturing operations

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The recessed region acts as an intermediary protective structure between the optical portion and the external environment, absorbing mechanical stresses and preventing direct exposure to contaminants during manufacturing

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If manual intervention is used to protect optical portions, then reliability is improved, but productivity decreases

Engineering Contradiction:

Improveoptical portion protectionVSAvoidmanufacturing speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The recessed region is pre-formed in the carrier before the optical portion is placed, establishing a protective structure in advance that prevents damage during subsequent handling and assembly operations

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The carrier's recessed structure provides self-protection for the optical portion, eliminating the need for manual protective measures and enabling automated handling processes

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS20260026409A1Optoelectronic package structure and method of manufacturing the same

Publication Date: 2026.01.22 ADVANCED SEMICON ENG INC

AI summary

An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier and a photonic component. The carrier includes an upper surface and a first lateral surface. The photonic component is disposed over an upper surface of the carrier and includes an optical portion. The carrier includes a recessed portion recessed from the first lateral surface of the carrier, and the optical portion of the photonic component is located within the recessed portion of the carrier from a top view perspective.