Optoelectronic Package Vertical Stacking for Heat Dissipation

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Solution Overview

Problem

Traditional cable transmission experiences signal integrity issues due to high impedance from capacitance and inductance, limiting data transmission speed and distance, which is addressed by adopting optoelectronic packages with improved heat dissipation and component arrangement for silicon photonics and optical engines.

Innovation Solution

An optoelectronic package structure featuring a heat source, thermal conductive element, and optoelectronic components arranged vertically, with the thermal conductive element positioned to efficiently dissipate heat and reduce substrate size, simplifying manufacturing and maintaining high data transmission speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional cable transmission is used for data transmission, then infrastructure is simple and cost-effective, but signal integrity deteriorates due to high impedance from capacitance and inductance at high speeds and frequencies

Engineering Contradiction:

Improvesignal integrityVSAvoidpower loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent replaces traditional electrical cable transmission with optical fiber transmission. The mechanical/electrical system of copper cables transmitting electrical signals is substituted with an optical system using light to transmit data, eliminating the capacitance and inductance issues that cause signal integrity degradation and power loss at high frequencies.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If heat dissipation structure is added to optoelectronic package, then heat dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent integrates the heat dissipation function directly into the substrate structure. The substrate serves dual purposes: as the mounting platform for optoelectronic components and as the heat dissipation pathway. This merging of structural and thermal management functions improves heat dissipation efficiency without increasing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed to perform multiple functions simultaneously: mechanical support for components, electrical connectivity through traces, and thermal conduction for heat dissipation. This multi-functionality eliminates the need for separate dedicated heat dissipation structures, maintaining package simplicity while achieving effective thermal management.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Speed

If optoelectronic components are arranged vertically to shorten signal transmission path, then data transmission speed is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvedata transmission speedVSAvoidcomponent alignment precision

Core Design Contradiction:

SpeedVSManufacturing precision

Solution Approach 1:

The patent transitions from traditional planar (2D) component arrangement to a vertical (3D) stacked configuration. By utilizing the vertical dimension, signal transmission paths are dramatically shortened, enabling faster data transmission. The vertical stacking also allows better heat dissipation from the heat source to the substrate, addressing thermal management simultaneously.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Area of stationary object

If substrate size is reduced to improve integration density, then manufacturing cost is reduced, but heat dissipation capability deteriorates

Engineering Contradiction:

Improvesubstrate sizeVSAvoidheat dissipation capability

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The patent changes the thermal conduction parameters of the substrate by selecting materials with high thermal conductivity and optimizing the substrate thickness. The substrate is designed with specific thermal properties that enable efficient heat dissipation from the heat source, allowing compact packaging without compromising thermal management capability.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation efficiency, reduces substrate size, and shortens signal transmission paths, improving yield and manufacturing complexity while maintaining high data transmission speed.

Implementation Method 1

The thermal conductive element defines a thermal conduction path P2 by which heat is transferred from the heat source to the thermal conductive element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230121954A1Optoelectronic package structure and method for manufacturing the same

Publication Date: 2023.04.20 ADVANCED SEMICON ENG INC

AI summary

An optoelectronic package structure is provided. The optoelectronic package structure includes a heat source, a thermal conductive element, and a first optoelectronic component and a second optoelectronic component. The thermal conductive element is disposed over the heat source. The thermal conductive element defines a thermal conduction path P2 by which heat is transferred from the heat source to the thermal conductive element. The first optoelectronic component and the second optoelectronic component are arranged along an axis different from a thermal conduction path P2.