Optoelectronic Package Warpage Control via Embedded Redistribution
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Solution Overview
Problem
The manufacturing of smaller photonic and electronic integrated circuits faces challenges due to warpage issues in manufacturing processes, which can lead to problems like solder skip during assembly.
Innovation Solution
An optoelectronic package design where a redistribution structure is directly formed on the active surface of a photonic component, reducing warpage and facilitating assembly by embedding an electronic component within a connection structure that includes a tapered via and encapsulant, ensuring proper alignment and contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If smaller PICs and EICs are required with rapid growth of electronics industry, then device miniaturization is achieved, but warpage issues in manufacturing processes become more important
Solution Approach 1:
The patent applies preliminary action by pre-forming the redistribution structure on the photonic component before assembly, and pre-designing the connection structure with embedded electronic components. This allows warpage to be controlled and compensated for during manufacturing, preventing solder skip and other assembly issues that would occur with smaller devices.
2Manufacturing precision
If redistribution structure is formed directly on photonic component, then warpage is reduced and assembly is facilitated, but manufacturing complexity increases
Solution Approach 1:
The patent merges the redistribution structure formation with the photonic component manufacturing process. The redistribution structure is formed directly on the photonic component substrate, combining two previously separate processes into one integrated manufacturing flow, which reduces warpage while managing complexity through integration rather than addition.
Solution Approach 2:
The connection structure is designed to embed the electronic component within it, creating a nested configuration where the electronic component is contained inside the connection structure. This nesting approach facilitates compact integration and reduces overall package complexity while maintaining precision.
3Reliability
If electronic component is embedded in connection structure, then alignment and contact are improved, but manufacturing precision requirements increase
Solution Approach 1:
The connection structure is pre-designed with embedded electronic components and proper alignment features before assembly. This preliminary design and positioning ensure that when the components are assembled, proper alignment and contact are achieved automatically, improving reliability while the pre-planned geometry manages the precision requirements.
Data Source
AI summary
An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.