Optoelectronic Assembly Packaging via Reflow Soldering Alignment
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Solution Overview
Problem
Existing optoelectronic assembly packaging structures face challenges such as inefficient active alignment, complexity in assembly processes, and incompatibility with reflow soldering surface mount technology, leading to low production efficiency and high costs.
Innovation Solution
A packaging structure for an optoelectronic assembly featuring a substrate with central symmetry, where optical transceivers and driver chips are mounted on one side and electrical contacts on the other, utilizing different surface areas for first and second contacts to maintain alignment through surface tension, and integrating an optical assembly for alignment with an optical fiber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If active alignment is used for optical coupling between Sub-PCBA and optical fiber connector, then optical alignment precision is improved, but alignment time increases and production efficiency decreases
Solution Approach 1:
The patent implements preliminary action by pre-positioning the optical transceiver at a fixed location on the substrate and pre-establishing the optical path alignment. The substrate is designed with a fixed optical transceiver mounting position that ensures optical alignment is achieved during the soldering process itself, eliminating the need for separate active alignment steps. This allows optical coupling to be accomplished as part of the standard reflow soldering process.
Solution Approach 2:
The patent replaces the mechanical active alignment system with a fixed geometric positioning system. Instead of using adjustable mechanical stages and real-time optical feedback mechanisms, the design uses a rigid substrate structure with predetermined mounting positions for the optical transceiver and optical fiber connector, ensuring alignment through precise mechanical design rather than active adjustment.
2Stability of the object's composition
If Sub-PCBA and main PCBA are fixed at 90 degrees with circuit pad welding, then structural stability is improved, but compatibility with reflow soldering surface mount technology decreases and production efficiency is reduced
Solution Approach 1:
The patent merges the optical transceiver assembly with the substrate by directly mounting the optical transceiver onto the substrate in a fixed position. The electrical contacts are integrated directly into the substrate structure, combining what were previously separate Sub-PCBA and main PCBA assemblies into a single integrated unit that is compatible with standard surface mount technology processes.
Solution Approach 2:
The substrate is designed to serve multiple functions simultaneously: it provides mechanical support for the optical transceiver, establishes optical alignment, provides electrical connections through integrated contacts, and enables compatibility with standard reflow soldering processes. This multi-functional design eliminates the need for specialized 90-degree fixed structures while maintaining structural stability.
3Measurement precision
If optical transceiver is mounted on base with fixed position provided by base, then optical coupling alignment is improved, but assembly complexity increases and production cost increases
Solution Approach 1:
The patent extracts the fixed-position providing function from a separate base structure and integrates it directly into the substrate. The substrate itself provides the fixed mounting position for the optical transceiver through its rigid structure and predetermined mounting locations, eliminating the need for a separate base component and reducing overall assembly complexity.
Solution Approach 2:
The patent combines the functions of the base and substrate into a single integrated substrate structure. The optical transceiver mounting position, electrical connections, and optical alignment features are all integrated into the substrate itself, eliminating the need for separate base components and reducing the number of assembly steps.
4Device complexity
If single substrate method is used for optoelectronic assembly production, then structure is simplified, but requirements for clamping fixture increase and production efficiency decreases
Solution Approach 1:
The patent applies segmentation by designing the substrate with distinct functional zones: an optical transceiver mounting position area, an electrical contacts area, and an optical fiber connector area. This segmentation allows each component to be positioned and assembled independently using standard surface mount technology, eliminating the need for complex custom clamping fixtures while maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the assembly process, reduces production costs, and enables the use of reflow soldering surface mount technology, while improving assembly efficiency and burn-in test efficiency, and reducing equipment costs.
Implementation Method 1
solder is arranged on the first contacts, and a surface tension generated when the solder melts keeps the first contacts in an original position; the second contacts are each arranged on a periphery of the first contacts, solder is arranged on the second contacts, and a surface tension generated when the solder melts keeps the second contacts in an original position
Data Source
AI summary
A packaging structure of optoelectronic assembly, optoelectronic assembly using same and preparation method thereof. The preparation method comprising, providing a PCB board with an electrical connection surface and an optical coupling surface at an interval; preparing the electrical connection surface and the optical coupling surface respectively; bonding electrical contacts; after mounting optical assembly and performing additional testing, cutting and preparing a plurality of PCB units, and preparing corresponding optoelectronic assembly. The invention can simultaneously prepare multiple optoelectronic assemblies, so assembly efficiency improved; burn-in test of a plurality of optoelectronic assemblies can be completed at one time, which reduces requirements for a testing tool, and can test a plurality of optoelectronic assemblies in batches with high testing efficiency; and the optoelectronic assembly is controlled to emit light through the testing tool, and the test method is simple; assembly process of the optoelectronic assembly is simple.