Optoelectronic Semiconductor Device Pixel Color Control
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Solution Overview
Problem
Existing optoelectronic semiconductor devices lack the ability to continuously adjust the color location of emitted radiation, limiting their versatility and application in lighting and display technologies.
Innovation Solution
A method of manufacturing optoelectronic semiconductor devices involves applying different converter materials to predetermined pixels of a semiconductor chip, allowing for continuous adjustment of the color location of emitted radiation by structuring a photostructurable layer and applying phosphor-based converter materials to specific illumination areas, enabling independent control of each pixel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single converter material is applied to the entire semiconductor chip, then the manufacturing process is simple, but the color location of emitted radiation cannot be adjusted
Solution Approach 1:
The semiconductor chip is divided into multiple illumination areas (pixels), and different converter materials are applied to different areas. This segmentation enables independent color control for each area, achieving continuous color location adjustment while maintaining a relatively simple manufacturing process using conventional photolithography and screen printing techniques.
Solution Approach 2:
Different converter materials with specific photoluminescence properties are applied to different illumination areas based on the desired color output. Each area has locally optimized converter material composition and thickness to achieve the target color location, enabling continuous color adjustment across the chip.
2Adaptability or versatility
If converter materials are applied to all illumination areas, then color adjustment capability is achieved, but manufacturing precision and material placement control become difficult
Solution Approach 1:
A photostructurable layer is applied to the semiconductor chip before applying the converter materials. This layer is selectively removed in desired patterns to create masks that guide precise converter material placement. The preliminary structuring of the photo layer enables accurate spatial control of converter materials without requiring high-precision direct placement techniques.
Solution Approach 2:
The photostructurable layer acts as an intermediary element between the semiconductor chip and the converter materials. It provides a convenient platform for precise pattern definition and material placement control, simplifying the manufacturing process while achieving high spatial precision in converter material distribution.
3Adaptability or versatility
If multiple converter materials are applied separately to different pixels, then continuous color adjustment is enabled, but the manufacturing time and process steps increase
Solution Approach 1:
Multiple converter materials are applied in a single manufacturing step using screen printing or similar techniques, rather than applying each material separately in sequential steps. This merging of multiple material applications into one operation maintains continuous color adjustment capability while significantly improving manufacturing throughput and reducing process time.
Solution Approach 2:
The manufacturing process uses universal techniques (screen printing, photolithography) that can handle multiple converter materials simultaneously, making the process versatile and efficient. The same equipment and methods used for single-material application are extended to multi-material application, maintaining productivity while achieving continuous color adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of semiconductor devices where the color temperature of emitted light can be continuously adjusted, enhancing their application in lighting and display technologies by enabling the production of devices that can emit a wide range of colors and white light with varying color temperatures.
Implementation Method 1
a photostructurable first photo layer is applied to the radiation side. In a step C) the first photo layer is photostructured, wherein holes are formed in the first photo layer in the region of first illumination areas
Implementation Method 2
different converter materials are applied to predetermined pixels of a semiconductor chip... allowing for continuous adjustment of the color location of emitted radiation
Data Source
AI summary
A method for manufacturing an optoelectronic semiconductor device and an optoelectronic semiconductor device are disclosed. In an embodiment a method includes applying a photostructurable first photo layer on the radiation side of a semiconductor layer sequence, photostructuring the first photo layer, wherein holes are formed in the first photo layer in regions of first illumination areas, applying a first converter material to the structured first photo layer, wherein the first converter material partially or completely fills the holes, thereby forming first converter elements in the holes, the first converter elements covering the associated first illumination areas, removing the first photo layer; and applying a second converter material to the radiation side at least in regions of second illumination areas, the second illumination areas being different from the first illumination areas.