Optoelectronic Module Positioning Member for Thermal Management
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Solution Overview
Problem
Optoelectronic modules face challenges in component positioning and heat dissipation, leading to compromised functionality due to increased temperatures and complex assembly processes.
Innovation Solution
The use of a positioning member coupled to a printed circuit board (PCB) with receptacles to securely position optical components, along with a thermally conductive housing design that facilitates heat transfer to the ambient atmosphere, addresses the issues of component positioning and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple optical components are arranged within the optoelectronic module, then the functionality of the module is enhanced, but the relative positioning of these components and optical fibers complicates the assembly process
Solution Approach 1:
The positioning member includes a base portion and multiple vertical portions with receptacles arranged in a nested configuration. Optical components are received within receptacles that are positioned at different heights on the vertical portions, creating a compact nested arrangement that simplifies assembly while maintaining multiple functional components within the module.
2Volume of moving object
If components are positioned closer together to reduce module size, then the compactness is improved, but heat generated during operation adversely affects the functionality of certain components
Solution Approach 1:
The positioning member is configured with receptacles at different vertical positions and orientations, allowing components with different thermal characteristics to be positioned in optimal locations. Heat-generating components can be placed in receptacles that facilitate heat dissipation, while temperature-sensitive components are positioned in cooler areas, thereby managing thermal conditions within the compact module structure.
3Reliability
If components are arranged to optimize heat dissipation, then the reliability is improved, but the assembly process becomes more complex
Solution Approach 1:
The positioning member serves multiple functions simultaneously: it provides mechanical support for optical components, establishes precise positioning and alignment, and facilitates heat dissipation through its vertical portion structure that enables optimal orientation of components relative to heat sinks or cooling surfaces. This multi-functionality reduces the need for separate components, thereby simplifying the overall assembly process while maintaining reliable heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the assembly process and maintains module functionality by effectively dissipating heat, thereby preventing temperature-related performance issues and improving the reliability of optoelectronic modules.
Implementation Method 1
a thermally conductive housing design that facilitates heat transfer to the ambient atmosphere
Data Source
AI summary
An optoelectronic module includes a housing and a printed circuit board (“PCB”) positioned within the housing. A positioning member is coupled to the PCB and includes one or more receptacles each configured to receive and secure positioning of an optical component relative to the PCB. The positioning member may include a plurality of receptacles positioned relative to one another in an arrangement defining a vertical array of receptacles, a lateral array of receptacles, or both. In one form, an optical component, when positioned in a receptacle of the positioning member, is spaced from the PCB. The positioning member may be formed of a thermally insulative or thermally conductive material, and a number of optical fibers may be routed between the positioning member and the housing.