Optoelectronic Probe Card Alignment for Concurrent DUT Testing
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Solution Overview
Problem
Existing optoelectronic device testing methods are slow and not suitable for high-volume manufacturing environments due to the use of individual electrical and optical probes that require manual alignment, which is time-consuming and prone to alignment errors.
Innovation Solution
The development of optoelectronic probe cards and testers that incorporate a fixed orientation lensed optical and electrical probes, allowing simultaneous alignment and testing of multiple devices, with optical and electrical communication capabilities, reducing the need for individual manipulators and minimizing alignment errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If individual electrical probes with manipulators are used for testing, then alignment flexibility is improved, but testing speed deteriorates and alignment precision worsens due to manual alignment requirements
Solution Approach 1:
The patent merges multiple individual probes into a single integrated probe card assembly that contains both electrical probes and optical probes. This consolidation allows simultaneous testing of multiple devices without requiring separate manipulators for each probe type, thereby increasing testing speed while maintaining alignment precision through the fixed relative positioning of probes within the card.
Solution Approach 2:
The probe card is pre-configured with probes positioned at fixed relative orientations before reaching the device under test. This preliminary arrangement of probes eliminates the need for manual alignment during testing, as the probes are already positioned correctly relative to each other and to the device features, thus improving both testing speed and alignment precision.
2Measurement precision
If manual alignment of individual probes is performed, then alignment precision can be adjusted, but testing time increases significantly
Solution Approach 1:
The probe card is pre-configured with probes positioned at fixed relative orientations before reaching the device under test. This preliminary arrangement of probes eliminates the need for manual alignment during testing, as the probes are already positioned correctly relative to each other and to the device features, thus improving both testing speed and alignment precision.
Solution Approach 2:
The fixed relative positioning of probes within the probe card assembly enables the system to self-align to device features without requiring external manual intervention. The probes maintain their predetermined geometric relationships automatically during testing, ensuring consistent alignment precision while eliminating time-consuming manual alignment procedures.
3Adaptability or versatility
If separate electrical and optical probe assemblies are used, then functional versatility is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple individual probes into a single integrated probe card assembly that contains both electrical probes and optical probes. This consolidation allows simultaneous testing of multiple devices without requiring separate manipulators for each probe type, thereby increasing testing speed while maintaining alignment precision through the fixed relative positioning of probes within the card.
Solution Approach 2:
The probe card serves as a universal testing platform that can perform both electrical and optical measurements simultaneously. By integrating multiple probe types into a single multi-functional device, the system reduces the overall complexity compared to using separate electrical and optical probe assemblies, while maintaining the versatility to test various device features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces testing time and enhances alignment precision, enabling efficient high-volume manufacturing by ensuring concurrent electrical and optical testing with improved coupling efficiency and reduced system costs.
Implementation Method 1
an optical probe assembly that includes a plurality of lensed optical probes configured for non-contact optical communication with at least one optoelectronic device of the DUT
Data Source
AI summary
Optoelectronic probe cards, optoelectronic testers, and related methods. The optoelectronic probe cards are configured for optical and electrical communication with a device under test (DUT) on a device substrate that includes a plurality of DUTs and includes an optical probe assembly and an electrical probe assembly. The optical probe assembly includes a plurality of lensed optical probes configured for non-contact optical communication with at least one optoelectronic device of the DUT. The electrical probe assembly includes a plurality of electrical probes configured for electrical communication with the DUT via electrical contact between the plurality of electrical probes and a plurality of contact pads of the DUT. The optoelectronic testers include a chuck, the optoelectronic probe card, an optical signal generation and analysis assembly, and an electrical signal generation and analysis assembly. The methods include actively and/or passively aligning components of the optoelectronic probe card with corresponding components of the DUT.