Optoelectronic Component With Separate Pump Device And Laser Chip
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Solution Overview
Problem
Existing optoelectronic components face challenges in being produced simply and compactly, as monolithic integration of pump devices and surface emitting semiconductor lasers requires complex semiconductor layer structures and compromises performance and wavelength control.
Innovation Solution
The optoelectronic component comprises a separate optical pump device and surface emitting semiconductor laser chip, where the pump device has a radiation exit area for transverse electromagnetic radiation coupling and a reflective layer sequence, allowing for efficient production and precise emission wavelength setting, with the laser chip fixed to the pump device and the reflective layer sequence positioned between the radiation exit area and the second radiation-generating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If monolithic integration of pump devices and surface emitting semiconductor lasers is used, then device compactness is improved, but manufacturing complexity increases and performance is compromised
Solution Approach 1:
The patent divides the optoelectronic component into separate modules: a pump device and a surface emitting semiconductor laser chip. These modules are produced independently and then coupled together, avoiding the need for complex monolithic integration while achieving compact overall device volume. The pump device and laser chip are distinct functional units that can be optimized separately during manufacturing.
Solution Approach 2:
The surface emitting semiconductor laser chip is mounted on top of the pump device, creating a nested configuration where one component is positioned within the spatial envelope of another. This nesting approach achieves compact integration without requiring complex monolithic semiconductor layer structures, as each component maintains its own optimized fabrication process.
2Volume of moving object
If monolithic integration of pump devices and surface emitting semiconductor lasers is used, then device compactness is improved, but production simplicity deteriorates
Solution Approach 1:
The patent divides the optoelectronic component into separate modules: a pump device and a surface emitting semiconductor laser chip. These modules are produced independently and then coupled together, avoiding the need for complex monolithic integration while achieving compact overall device volume. The pump device and laser chip are distinct functional units that can be optimized separately during manufacturing.
3Ease of manufacture
If separate production of pump devices and laser chips is used, then manufacturing simplicity is improved, but device compactness deteriorates
Solution Approach 1:
The surface emitting semiconductor laser chip is mounted on top of the pump device, creating a nested configuration where one component is positioned within the spatial envelope of another. This nesting approach achieves compact integration without requiring complex monolithic semiconductor layer structures, as each component maintains its own optimized fabrication process.
Solution Approach 2:
The patent combines separately produced pump devices and laser chips into an integrated optoelectronic component. The mechanical coupling of these distinct modules achieves compactness comparable to monolithic integration while preserving the manufacturing simplicity of separate production processes.
4Ease of manufacture
If separate production of pump devices and laser chips is used, then production simplicity is improved, but wavelength control precision deteriorates
Solution Approach 1:
The patent divides the optoelectronic component into separate modules: a pump device and a surface emitting semiconductor laser chip. These modules are produced independently and then coupled together, avoiding the need for complex monolithic integration while achieving compact overall device volume. The pump device and laser chip are distinct functional units that can be optimized separately during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient production of compact optoelectronic components with precise emission wavelength control, avoiding the complexity of monolithic integration and allowing each component to be produced optimally without compromising performance.
Implementation Method 1
a reflective layer sequence including a Bragg mirror
Implementation Method 2
reflective layer sequence including a Bragg mirror
Implementation Method 3
an optical pump device including a first radiation-generating layer wherein electromagnetic radiation is generated during operation of the pump device
Data Source
AI summary
An optoelectronic component includes an optical pump device including a first radiation-generating layer and a first radiation exit area at a top side of the pump device, wherein electromagnetic radiation generated during operation of the pump device is coupled out from the pump device through the first radiation exit area transversely and at least in part non-perpendicularly with respect to the first radiation-generating layer, and a surface emitting semiconductor laser chip including a reflective layer sequence including a Bragg mirror, and a second radiation-generating layer, wherein the surface emitting semiconductor laser chip is fixed to the top side of the pump device, and the reflective layer sequence is arranged between the first radiation exit area and the second radiation-generating layer.