Optoelectronic Package Layout With Pyramid Reflectors for Light Extraction
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Solution Overview
Problem
The development of miniature optoelectronic systems faces challenges in efficiently integrating semiconductor and optoelectronic elements with effective light reflection and electrical connectivity, particularly in Chip-Level Package (CLP) designs, which require innovative packaging solutions to enhance light emission and energy transfer.
Innovation Solution
The integration of optoelectronic elements with semiconductor epitaxial layers, electrodes, and a reflecting structure in the form of pyramids between adjacent elements, allowing for efficient light reflection and electrical separation, along with a carrier and sub-carrier system for supporting and connecting these elements, enabling the formation of a network for luminous and electric energy transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optoelectronic elements are integrated in a compact arrangement to achieve miniature packaging, then the device size is reduced, but light extraction efficiency deteriorates due to limited space for light reflection and dispersion
Solution Approach 1:
The patent introduces a third dimension by forming three-dimensional pyramid-shaped reflecting structures between adjacent optoelectronic elements. These pyramids extend vertically from the substrate surface, utilizing the Z-axis dimension to create light reflection paths without increasing the planar footprint. The pyramidal geometry provides multiple reflective surfaces at different angles, enabling efficient light extraction from side-emitting LEDs while maintaining compact packaging.
Solution Approach 2:
The patent introduces intermediary reflecting structures (pyramids) that mediate between adjacent optoelectronic elements. These pyramids act as intermediate light redirecting elements that capture light emitted from the sides of LED chips and reflect it upward toward the light extraction surface. The pyramids serve as a bridging mechanism that converts side-emitted light into upward-directed light without requiring direct modification of the LED chips themselves.
2Productivity
If multiple optoelectronic elements are closely integrated to improve energy transfer, then the system density increases, but electrical connectivity and signal isolation become more difficult to achieve
Solution Approach 1:
The patent divides the space between adjacent optoelectronic elements into segmented regions by introducing pyramidal reflecting structures. These pyramids create distinct spatial zones that facilitate both optical coupling and electrical isolation. The segmented arrangement allows for independent electrical connections to each LED element while maintaining optical interaction through the reflecting surfaces, thereby simplifying the electrical connectivity architecture in dense integrations.
Solution Approach 2:
The patent applies local quality by providing different functional characteristics to different regions of the packaging structure. The pyramidal reflecting structures are strategically positioned in specific locations between adjacent LEDs to optimize light reflection paths. The substrate surface is selectively designed with varying reflectivity and geometry in different zones to enhance light extraction from specific elements while maintaining electrical isolation, thereby managing complexity through localized functional differentiation.
3Ease of manufacture
If conventional packaging processes are used for LED integration, then manufacturing simplicity is maintained, but light reflection and energy transfer efficiency are insufficient
Solution Approach 1:
The patent merges multiple functions into the pyramidal reflecting structures. These structures simultaneously serve as light reflection surfaces, mechanical spacers between adjacent LEDs, and structural support elements. By combining these functions into a single integrated feature, the design achieves improved light extraction efficiency without proportionally increasing manufacturing complexity. The pyramids can be formed using standard semiconductor fabrication techniques such as etching and deposition, integrating them into existing manufacturing workflows.
Solution Approach 2:
The patent utilizes parameter changes by varying the geometry, size, and material composition of the pyramidal reflecting structures to optimize performance. The pyramid height, base dimensions, and apex angle can be adjusted to control light reflection characteristics. Different materials with varying refractive indices and reflectivity can be used for the pyramids to tailor the optical properties. These parameter variations enable optimization of light extraction efficiency while maintaining compatibility with conventional packaging processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact optoelectronic systems with improved light extraction and energy transfer capabilities, suitable for various applications such as illumination, display, and image recognition, by effectively addressing the integration and connectivity challenges in CLP designs.
Implementation Method 1
a reflecting structure having a shape of pyramid, formed between two adjacent optoelectronic elements of the plurality of optoelectronic elements and electrically separated from the plurality of optoelectronic elements, wherein the reflecting structure is configured to reflect light from the two adjacent optoelectronic elements upwards to leave the optoelectronic system
Data Source
AI summary
An optoelectronic system having a first optoelectronic element with a first surface; a second optoelectronic element with a second surface; an IC, with a third surface coplanar with the first surface and the second surface; an electrical connection, electrically connecting the first optoelectronic element and the IC; and a material, surrounding the first optoelectronic element, the second optoelectronic element, and the IC, and exposing the first surface, the second surface, and the third surface.