Optoelectronic Component Recess Geometry for Dislocation Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optoelectronic components face challenges in preventing dislocations at fracture edges, particularly on mirror surfaces, due to shallow recesses being ineffective and deep recesses acting as disturbance centers, requiring precise control of recess depth and geometry to achieve effective passivation and dislocation suppression.
Innovation Solution
The component features a recess with at least one inclined side surface, allowing for reliable overmolding with a dielectric for passivation, and a defined depth in the active zone region to prevent dislocations, with side surfaces angled between 95° to 160° and a depth of 100 nm to 800 nm, reducing stress and facilitating efficient shielding of the active zone.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a recess is made shallow to avoid acting as a disturbance center, then manufacturing is easier, but it becomes ineffective in reducing dislocations at the fracture edge
Solution Approach 1:
The patent changes the geometric parameters of the recess, specifically setting the depth between 100-800 nm and side surface angles between 95°-160°, to optimize both dislocation suppression effectiveness and manufacturing feasibility. This parameter optimization resolves the contradiction by finding a depth range that is deep enough to prevent dislocations but not so deep as to create disturbance centers.
Solution Approach 2:
The patent applies local quality by creating an inclined side surface structure specifically at the recess region where dislocations form, while maintaining the overall mirror surface quality. The inclined surfaces (95°-160° angles) are localized to the recess area to deflect dislocations, while the rest of the mirror surface remains flat for optimal optical performance.
2Reliability
If a recess is made deep to effectively prevent dislocations, then dislocation suppression improves, but it acts as a disturbance center and reduces component reliability
Solution Approach 1:
The patent optimizes the recess depth parameter to be between 100-800 nm, which is sufficient to intercept dislocations at the fracture edge but not deep enough to create stress concentration or act as a disturbance center. This precise parameter control resolves the contradiction between effective dislocation prevention and avoiding harmful disturbances.
Solution Approach 2:
The patent employs rounded transitions at the recess corners and inclined side surfaces instead of sharp edges. The curved and inclined surfaces distribute stress more evenly and prevent the formation of disturbance centers, while still maintaining effective dislocation suppression.
3Ease of manufacture
If vertical side walls are used in the recess, then manufacturing is simpler, but dielectric coating for passivation is unreliable
Solution Approach 1:
The patent replaces vertical side walls with inclined side surfaces (95°-160° angles) and rounded transitions. These curved and inclined surfaces eliminate sharp corners where dielectric coating would be unreliable, providing smooth surfaces that ensure complete and uniform coating coverage while remaining manufacturable through standard etching processes.
4Ease of manufacture
If the recess depth is not precisely controlled, then manufacturing is easier, but dislocation prevention at the fracture edge is ineffective
Solution Approach 1:
The patent defines a specific depth range (100-800 nm) that provides effective dislocation prevention while accommodating reasonable manufacturing tolerances. This parameter range is optimized to ensure that even with variations in manufacturing, the recess remains deep enough to intercept dislocations but not so deep as to create disturbance centers.
Solution Approach 2:
The inclined side surfaces and rounded transitions provide a more robust structure that is less sensitive to precise depth control. The gradual slopes and curves ensure effective dislocation deflection even when the exact depth varies within the specified range, improving manufacturing tolerance compared to sharp-edged vertical recesses.
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to an optoelectronic component with a layered structure having an active zone for generating electromagnetic radiation, wherein the active zone is arranged in a first plane, wherein a recess is provided in the surface of the layered structure, wherein the recess adjoins an end face of the component, wherein the end face is arranged in a second plane, wherein the second plane is arranged substantially perpendicular to the first plane, wherein the recess has a bottom surface and a side surface, wherein the side surface is arranged substantially perpendicular to the end surface, wherein the side surface is arranged at an angle other than 90° to the first plane of the active zone, and wherein the bottom surface is arranged in the region of the first plane of the active zone.