Optoelectronic Component Recess Wall Shading for UV Shielding
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Solution Overview
Problem
Conventional optoelectronic semiconductor components with epoxy-resin-based encapsulants are prone to delamination under UV exposure due to insufficient bonding with polyphthalamide-based thermoplastic housing base bodies, leading to reduced light output and potential complete detachment.
Innovation Solution
A semiconductor component design featuring a recess wall with shaded subareas around the semiconductor chip, covered by encapsulant, which reduces radiation exposure and includes anchoring elements to enhance bonding, using a silicone resin encapsulant and a housing base body configured for miniaturized designs, such as LEDs and photodiodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy-resin-based encapsulant is used, then bonding strength with housing base body is improved, but UV resistance deteriorates
Solution Approach 1:
The recess wall is designed with differentiated zones: a first region with high reflectivity for light redirection, and a second region with low reflectivity (shaded subarea) for UV shielding. This local quality differentiation allows the encapsulant to be protected from UV radiation in critical bonding areas while maintaining overall encapsulation functionality.
Solution Approach 2:
The housing base body structure acts as an intermediary between the UV radiation source and the encapsulant. By incorporating shaded subareas and specific wall geometries, the housing base body intercepts and redirects UV radiation before it reaches the encapsulant, preventing direct UV exposure while maintaining the encapsulant's bonding function.
2Object-affected harmful factors
If silicone resin encapsulant is used, then UV resistance is improved, but bonding strength with housing base body deteriorates
Solution Approach 1:
The recess wall is designed with differentiated zones: a first region with high reflectivity for light redirection, and a second region with low reflectivity (shaded subarea) for UV shielding. This local quality differentiation allows the encapsulant to be protected from UV radiation in critical bonding areas while maintaining overall encapsulation functionality.
Solution Approach 2:
The housing base body structure acts as an intermediary between the UV radiation source and the encapsulant. By incorporating shaded subareas and specific wall geometries, the housing base body intercepts and redirects UV radiation before it reaches the encapsulant, preventing direct UV exposure while maintaining the encapsulant's bonding function.
3Volume of moving object
If housing base body is miniaturized, then component size is reduced, but structural stability deteriorates
Solution Approach 1:
The recess wall incorporates curved surfaces and angled facets instead of flat planes. The first wall region has a curved surface for light redirection, while the second wall region has an angled surface forming the shaded subarea. These curved and angled geometries provide structural reinforcement in miniaturized components, enhancing stability while maintaining compact dimensions.
Solution Approach 2:
The recess wall is segmented into functionally distinct regions: a first region for light redirection and a second region for UV shielding. This segmentation allows each region to be optimized for its specific function while collectively providing both miniaturization benefits and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces the risk of delamination and maintains light output by shielding the bond line from radiation, allowing for miniaturized and reliable optoelectronic components with improved UV resistance.
Implementation Method 1
a wall bounding the recess is shaped such that there are formed on said wall, as viewed looking down on the front side of the semiconductor component, i) plural shaded subareas arranged around the semiconductor chip... which in particular is in shadow as viewed from substantially any point in a radiation emitting region of the radiation emitting semiconductor chip
Data Source
AI summary
An optoelectronic semiconductor component comprising at least one radiation emitting semiconductor chip disposed in a recess of a housing base body, wherein the recess is bounded laterally by a wall surrounding the semiconductor chip and is at least partially filled with an encapsulant that covers the semiconductor chip and is well transparent to an electromagnetic radiation emitted by the semiconductor chip An inner side of the wall, bounding the recess, is configured such that, as viewed looking down on the front side of the semiconductor component, a subarea of the inner side is formed which extends ring-like all the way around the semiconductor chip and which is in shadow as viewed from the radiation emitting semiconductor chip and which is at least partially covered by encapsulant all the way around the semiconductor chip. A housing base body for such a semiconductor component is also specified.