Optoelectronic Module Assembly with Recessed Substrate
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Solution Overview
Problem
In consumer electronics, such as smartphones, space is limited for integrating optoelectronic modules, which require compact and easy-to-manufacture designs that allow for active alignment and efficient heat dissipation while maintaining a small z-height.
Innovation Solution
The optoelectronic module assembly includes an active optoelectronic component on a mounting substrate with a spacer establishing a specific distance to an optical sub-assembly, using a recessed substrate with different thermal conductivity materials and electrical contacts for alignment and mounting, and a filler material for thermal management, allowing for compact integration and active alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional optoelectronic module design is used, then the module can be manufactured, but the z-height becomes too large for compact consumer electronics integration
Solution Approach 1:
The patent utilizes the recessed surface of the substrate to mount the optoelectronic component, effectively using the vertical dimension (z-dimension) of the substrate recess to reduce the overall module height. By placing the component in a recess rather than on a flat surface, the module achieves a smaller z-height while maintaining proper component spacing and optical alignment.
Solution Approach 2:
The optoelectronic component is nested within the recessed area of the substrate, with the spacer structure fitting into the recessed geometry. This nesting approach allows the component to be housed within the substrate volume rather than extending beyond it, reducing the overall module footprint and z-height.
2Manufacturing precision
If active alignment is implemented, then optical precision is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The spacer structure includes protrusions that automatically engage with corresponding features on the optoelectronic component during assembly. This self-aligning mechanism eliminates the need for complex external alignment equipment or procedures, as the component self-positions itself through the mechanical interplay of the spacer protrusions and component features, achieving precise optical alignment through the manufacturing process itself.
Solution Approach 2:
The spacer is pre-formed with specific protrusion geometries that are designed to match the optoelectronic component features. This preliminary preparation of the alignment features in the spacer allows for precise positioning to be achieved during a simple assembly operation, rather than requiring complex alignment procedures during final assembly.
3Temperature
If heat dissipation is prioritized, then thermal management is improved, but the module size increases
Solution Approach 1:
The substrate is designed with a recessed area that provides localized thermal management for the optoelectronic component. The recessed geometry creates a concentrated heat sink volume directly beneath the component, improving thermal conduction efficiency in the critical local region without requiring the entire substrate to be thick or large. This localized approach to thermal management achieves effective heat dissipation while maintaining compact overall module dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the fabrication of compact optoelectronic modules with active alignment and efficient heat dissipation, addressing space constraints in consumer electronics while maintaining a reduced z-height and facilitating easy manufacturing.
Implementation Method 1
a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly
Implementation Method 2
The recessed substrate can include a first portion and a second portion, the second portion of the recessed substrate being composed of a material having higher thermal conductivity than the first portion
Implementation Method 3
The filler material preferably has good thermal conductivity and/or good heat capacity
Implementation Method 4
The filler material preferably has good thermal conductivity and/or good heat capacity
Data Source
AI summary
An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.