Optoelectronic Component Reinforcing Body for Stability
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Solution Overview
Problem
Optoelectronic components face deformation and bending issues due to reaction contractions of encapsulation compounds and differing expansion behaviors with the carrier material, leading to reliability and quality problems, especially in larger components with small thicknesses, and existing solutions like mechanical treatment or adding glass particles complicate processing and increase the risk of crack formation or delamination.
Innovation Solution
Incorporating reinforcing bodies made of various materials, such as metals, semimetals, or fibers, into the optoelectronic components to enhance mechanical bending strength and geometrical stability without increasing dimensions or mechanical load, and integrating these bodies within the component or housing to reduce stress and prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If mechanical treatment is applied to reduce bending or deformation, then geometrical stability is improved, but the component is subjected to great mechanical load which may cause crack formation or delamination
Solution Approach 1:
The reinforcing body is integrated into the component before the component is put into service, providing pre-reinforcement that prevents bending and deformation without requiring subsequent mechanical treatment that would subject the component to damaging loads
Solution Approach 2:
The component is constructed as a composite structure with a carrier, encapsulation compound, and reinforcing body made of different materials (metal, semimetal, or fiber), combining the properties of each material to achieve both geometrical stability and resistance to crack formation
2Stability of the object's composition
If glass particles are added to adapt expansion coefficients, then expansion behavior is improved, but processing difficulty increases substantially
Solution Approach 1:
The reinforcing body is made of metal, semimetal, or fiber materials that can be selected to match the expansion coefficient of the carrier, providing expansion adaptation without requiring the addition of glass particles to the encapsulation compound
Solution Approach 2:
The reinforcing body is placed in specific locations within the component where expansion control is most needed, providing localized adaptation of expansion behavior without uniformly modifying the entire encapsulation compound
3Strength
If component dimensions are increased to improve mechanical properties, then bending strength is improved, but the component thickness remains small which limits loading capacity
Solution Approach 1:
The reinforcing body made of high-strength metal, semimetal, or fiber materials provides enhanced bending strength to the carrier without requiring an increase in the overall dimensions or thickness of the component
Solution Approach 2:
The reinforcing body may be segmented into multiple reinforcing elements distributed throughout the component, providing enhanced mechanical properties without increasing the overall component volume
4Stability of the object's composition
If subsequent thermal and mechanical treatment is applied to avoid deformation, then geometrical stability is improved, but the component is subjected to additional thermal and mechanical load
Solution Approach 1:
The reinforcing body is integrated during the manufacturing process before the component is put into service, providing pre-reinforcement that prevents deformation without requiring subsequent thermal and mechanical treatment that would subject the component to additional damaging loads
Data Source
AI summary
An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound.


