Optoelectronic Component With Segmented Lead Frame Recesses
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Solution Overview
Problem
Existing optoelectronic components face challenges in ensuring specific regions of the lead frame remain uncovered by plastic material during injection molding or transfer molding, making it difficult to provide accurate electrical connections and markings for semiconductor chips and bond wires.
Innovation Solution
The design includes a housing with a lead frame section partially embedded in plastic, featuring distinct recesses on the upper side where specific sections remain uncovered by plastic, allowing for separate regions for semiconductor chips and electrical contacting, and incorporating a marking for alignment and functional checking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the lead frame is embedded in plastic material during injection molding, then the housing structure is formed and protected, but it becomes difficult to provide uncovered regions on the lower side at positions not directly next to the upper side regions intended for chip mounting
Solution Approach 1:
The molding tool is divided into multiple independent parts, each responsible for sealing specific regions of the lead frame. This segmentation allows different sections of the lead frame to have different coverage states (covered or uncovered) by assigning different sealing responsibilities to different tool parts, thereby achieving complex embedding patterns without requiring a monolithic complex tool design
Solution Approach 2:
Different regions of the lead frame are treated differently during the molding process. Specific sections are sealed by molding tool parts while other sections remain uncovered, creating local variations in the embedding quality. This allows precise control over which regions are covered by plastic and which remain exposed for electrical connections
2Ease of manufacture
If sections of the lead frame are sealed by molding tool parts, then the uncovered regions are maintained for electrical connection, but it is difficult to provide uncovered regions at non-adjacent positions on the lower side
Solution Approach 1:
The molding tool parts are pre-configured to bear on specific sections of the lead frame before the injection molding process begins. This preliminary positioning ensures that the correct regions are sealed and the correct regions remain uncovered, achieving precise positioning without requiring complex real-time adjustments during the manufacturing process
3Stability of the object's composition
If the lead frame regions are intentionally or unintentionally covered by plastic material, then the housing is fully formed, but accurate electrical connections and markings for semiconductor chips become difficult to achieve
Solution Approach 1:
The housing structure is designed with localized variations in plastic material coverage. While the majority of the lead frame is covered by plastic for structural stability, specific regions are intentionally left uncovered to maintain precise alignment features and electrical connection points. This local differentiation allows the housing to be both structurally stable and precisely aligned
Data Source
AI summary
An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.