Optoelectronic Semiconductor Device for Compact Flashlight Lighting
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Solution Overview
Problem
Existing optoelectronic semiconductor devices struggle to efficiently emit light of specific spectral compositions and adapt to ambient lighting conditions, requiring separate optical components for light mixing, which limits their compactness and versatility in applications like flashlights.
Innovation Solution
A semiconductor device comprising multiple closely packed semiconductor chips emitting different colors, integrated on a carrier with electrical connection surfaces, allowing for adjustable light emission without separate optics, using conventional chips and phosphors to achieve color locus matching and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple semiconductor chips emitting different colors are used, then the spectral composition and color reproduction are improved, but the device complexity and size increase due to requiring separate optical components for light mixing
Solution Approach 1:
The patent combines multiple semiconductor chips emitting different colors (violet, blue, cyan, green, yellow-green, yellow, orange, red) into a single integrated device array. By merging these chips and their control circuits into one compact unit, the patent eliminates the need for separate optical mixing components, thereby improving spectral composition while reducing device complexity
Solution Approach 2:
The semiconductor device array serves multiple functions simultaneously: it provides full-color spectral emission, acts as its own light mixing system through precise spatial arrangement of chips, and enables adjustable color composition through electronic control. This multi-functionality eliminates the need for additional dedicated optical mixing components
2Adaptability or versatility
If separate optical components are used for light mixing, then the spectral composition can be adjusted, but the device size and compactness are worsened
Solution Approach 1:
The patent segments the light emission function into multiple discrete semiconductor chips, each emitting a specific color. These segmented chips are arranged in a precise spatial pattern on a single substrate, allowing independent control of each color channel. This segmentation enables color composition adjustment without requiring additional optical mixing components, thus maintaining compact device size
Solution Approach 2:
The patent transitions from using separate optical components for color mixing to achieving color mixing through spatial arrangement in the two-dimensional plane of the substrate. By utilizing the spatial dimension and precise positioning of multiple chips, the system achieves color composition adjustment functionality without adding volume in the third dimension
3Ease of manufacture
If conventional semiconductor chips and phosphors are used, then the manufacturing ease and cost are improved, but the efficiency of achieving desired color locus matching is worsened
Solution Approach 1:
The patent employs parameter optimization by carefully selecting the specific wavelengths and intensities of each semiconductor chip type (violet at 405nm, blue at 450nm, cyan at 495nm, green at 530nm, yellow-green at 560nm, yellow at 590nm, orange at 610nm, red at 630nm). By changing and optimizing these spectral parameters, the system achieves accurate color locus matching (including Planckian locus and blackbody radiator loci) while using conventional, easily manufactured semiconductor chips and phosphors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, adaptable light emission that replicates ambient lighting, ensuring accurate color reproduction and modulation, with a compact design suitable for mobile devices, eliminating the need for additional optics and allowing for sequential or simultaneous operation of the semiconductor chips.
Implementation Method 1
A plurality of semiconductor chips 31-35, in particular light-emitting diodes (LEDs), are mounted on the connection surfaces 22
Implementation Method 2
Phosphors for the colors red, green, yellow-orange and optionally cyan are used to obtain these colors preferably from blue light
Data Source
AI summary
In one embodiment, the optoelectronic semiconductor device comprises a carrier having electrical connection surfaces on a carrier upper side. At least four semiconductor chips are configured to emit light of different colors from each other. The semiconductor chips are mounted close to each other on the connection surfaces so that a distance between adjacent semiconductor chips is at most 100 μm in a top view on the carrier upper side.