Optoelectronic Semiconductor Components Defect Isolation
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Solution Overview
Problem
In optoelectronic semiconductor chips, crystal defects can render entire modules unusable, especially in densely packed arrangements like video walls, where replacing a defective chip is difficult, leading to high failure rates during production.
Innovation Solution
A method involving the identification of defect regions in semiconductor layer sequences, followed by the formation of functional regions that bypass these defects, allowing the semiconductor components to be separated and produced without the defective areas, ensuring the active regions are electrically isolated from the defects, thereby increasing production yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor chips are densely packed in modules, then the module capacity increases, but the difficulty of replacing defective chips increases and failure rate increases
Solution Approach 1:
The patent applies segmentation by dividing the semiconductor layer sequence into multiple independently functional regions, each capable of operating autonomously. This allows selective deactivation or removal of defective segments while preserving functional ones, making repair and replacement feasible even in densely packed modules.
Solution Approach 2:
The patent implements local quality by creating regions with different functional characteristics within the semiconductor structure. Each region is optimized independently, and defective regions can be identified and isolated locally without affecting the entire module, enabling targeted repairs in high-density configurations.
2Quantity of substance
If semiconductor chips are densely packed in modules, then the module capacity increases, but the failure rate during production increases
Solution Approach 1:
By segmenting the semiconductor layer sequence into independent functional regions, the patent reduces the propagation of defects. A defect in one region does not necessarily render the entire module unusable, thereby reducing the overall failure rate while maintaining high module capacity through dense packing of multiple functional regions.
Solution Approach 2:
The patent applies preliminary action by pre-structuring the semiconductor layer sequence with multiple independently functional regions before module assembly. This allows for pre-screening and identification of potential defect regions, enabling proactive measures to prevent production failures while maximizing module capacity.
3Productivity
If defect regions are isolated and bypassed, then production yield increases, but the device complexity increases
Solution Approach 1:
The patent uses segmentation to create clearly defined functional regions that can be independently processed and tested. This structured approach simplifies the identification and isolation of defect regions, allowing for automated processing that increases production yield without proportionally increasing device complexity.
Solution Approach 2:
By implementing local quality variations in the semiconductor layer sequence, the patent creates regions that can be selectively activated or deactivated. This allows for straightforward defect management through local modifications rather than complex global changes, thereby increasing production yield while minimizing added complexity.
Data Source
AI summary
A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.